Taiwan Semiconductor Manufacturing Comp. Ltd.

Yong-Mao Hsu

Jeng-Yann Tsay

Chih-Pen Yen

Chein-Fang Lin

Detecting blade vibration via ultrasonic waves is disclosed. The blade may be part of a robot that is used in conjunction with semiconductor device fabrication. A process chamber is provided that has a sidewall and a base defining a cavity contained therein. A rotatable blade is mounted at a center of the cavity that has a base portion and a tip portion extensible from the center to the sidewall of the process chamber. One or more ultrasonic sensors are mounted on the base adjacent to the sidewall. Ultrasonic waves are sent and received toward and reflected by the tip portion of the wafer blade to determine the tip portion's position. In this way, vibrational movement of the blade can be detected.

Growing community of inventors

Tainan, Taiwan

Yong-Mao Hsu