Samsung Electronics Co., Ltd.

Yong-Kyun Sun

Hyun-Ho Kim

Choo-ho Kim

Hee-Sang Yang

Ho-Jae Byon

Yo-Se Eum

Ho-Soo Jang

Jung-Hwan Woo

Jae-Bong Shin

Youn-Sung Ko

Tai-Kew Choi

A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Equipment and method for cutting package

Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

Die attaching apparatus

Growing community of inventors

Chungcheongnam-do, South Korea

Yong-Kyun Sun