Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Seagate Technology Incorporated

Seagate Technology International

Yong-kwan Kim

Hirotsugu Kishimoto

Hyunjae Na

Seokwon Jang

Yoo-Sang Hwang

Chul Ho Jeong

Sungguk An

Se-keun Park

Jin-a Kim

Bong-Soo Kim

Joo-Young Lee

Kyu Young Kim

Eun-Jung Kim

Hansun Ryou

Sohra Han

Yonghyuck Lee

Hyunjun Cho

Hongkwan Lee

Seung-bum Hong

Cha-Won Koh

Eun-Joo Jang

Se-Myeong Jang

Sung-Hee Han

Shin-Ae Jun

Yeong-Cheol Lee

Simon Buehlmann

Tae-jin Park

Dae-Won Kim

Dongwoo Seo

Dae-Ik Kim

Sung-hoon Choa

Taehyeog Jung

Je-min Park

Chan-Sic Yoon

Chang-Hyun Cho

Ki-Seok Lee

Sung-Un Kwon

Jangdoo Lee

Myeong-Dong Lee

Sungchul Choi

Boa Kim

Augustin Jinwoo Hong

Ho-in Ryu

Kyung-Eun Kim

Mansik Myeong

Jinnyoung Heo

Ki-Hyung Nam

Suchang Ryu

Shin-Hee Han

Pulunsol Cho

Hyeon-Ok Jung

Dae-Eun Jeong

Min-Su Choi

Sunjoong Gwak

Young-Sik Seo

Byoung-Wook Jang

Jung-Woo Song

Jiin Yoon

Seoyoung Jang

Sung-ki Jung

Hye-Young Kang

Young-Sin Kim

Dong-Sik Kong

Ho-joong Lee

Sung-hoond Choa

Kyungeun Lee

An electronic device includes a display panel including a folding area and first and second non-folding areas spaced apart from each other with the folding area between the first and second non-folding areas, and a digitizer including a first non-folding portion overlapping the first non-folding area, a second non-folding portion overlapping the second non-folding area, and a folding portion overlapping the folding area and including holes. The digitizer includes first loop coils in a first direction and second loop coils in a second direction and insulated from and intersecting with the first loop coils. The second loop coils may include non-folding coils respectively in the first and second non-folding portions and folding coils, at least one of which is in the folding portion. The non-folding coils are driven in a first mode, and the folding coils are driven in a second mode.

Electronic device

An electronic apparatus is provided and includes a display module having a folding region foldable with respect to a folding axis and including a first non-folding region and a second non-folding region spaced apart from each other along a second direction, and a digitizer disposed under the display module, and the digitizer includes a base part including base layers, first and second sensing coils disposed between the base layers and insulated from each other, and an upper reinforcement part including a first reinforcement layer and a second reinforcement layer each of which is disposed on an upper surface of the base part, and which are spaced apart from each other along the second direction with the folding region therebetween, wherein at least a portion of the base part containing either synthetic rubber or polydimethylsiloxane (PDMS).

Electronic apparatus including a digitizer

A foldable display device includes a display module including a first non-folding portion, a second non-folding portion, and a first folding portion between the first non-folding portion and the second non-folding portion, a first support member on a lower surface of the display module, the first support member including a first support portion supporting the first non-folding portion, a second support portion supporting the second non-folding portion, and a first opening pattern overlapping the first folding portion, and including a glass material, and a second support member under the first support member and supporting the display module.

Foldable display device including rigid support member

A digitizer includes a first sensing coil disposed in an active region, a first dummy line disposed in the same layer as the first sensing coil, a second sensing coil disposed below the first sensing coil in the active region, a second dummy line disposed in the same layer as the second sensing coil, a bridge line disposed below the second sensing coil, and a third dummy line disposed in the same layer as the bridge line. At least two dummy lines among the first, second, and third dummy lines extend in the same direction.

Digitizer including dummy lines and foldable display device including the same

A display device includes a display module which includes a first non-folding area, a folding area, and a second non-folding area, and a digitizer which includes a first area overlapping the first non-folding area and a portion of the folding area, a second area overlapping the folding area, and a third area overlapping a portion of the folding area and the second non-folding area, where a plurality of holes is defined in the second area through the digitizer, and the digitizer includes a base layer, a plurality of first coils, a plurality of second coils, first signal lines which are connected to the plurality of first coils, overlap the first area, the second area, and the third area, and do not overlap the plurality of holes, and second signal lines connected to the plurality of second coils and overlapping the third area.

Display device

An electronic apparatus includes a display panel and a digitizer disposed under the display panel and provided with a plurality of holes defined therethrough to overlap the folding region. The digitizer includes a first base layer, first loop coils including first first coils and second first coils, a second base layer disposed under the first base layer, second loop coils including first second coils and second second coils, and interposed between the first base layer and the second base layer, and bridge patterns. A first first line included in one bridge pattern is connected to a corresponding first first coil, and a second first line included in the bridge pattern is connected to the second first coil which receives a signal the same as a signal of the first first coil.

Electronic apparatus

An electronic device includes: a display panel and a digitizer including first and second non-folding parts and a folding part between the first and second non-folding parts. The digitizer includes a base layer, first loop coils on the base layer and each including a first part on the first non-folding part, a second part on the second non-folding part, and a third part on the folding part, second loop coils below the base layer. The third part includes first patterns adjacent to first ends of first group holes, second patterns adjacent to second ends of second group holes, and third patterns connecting the first and second patterns. Each of the first and second patterns has a curvature.

Digitizer and electronic device including the same

A display device includes a display module and a support plate disposed on the display module and including a plurality of first fibers and a plurality of second fibers disposed on the first fibers and extending to cross the first fibers in a plan view. An opening is defined in the support plate and includes first sides parallel to an extension direction of the first fibers and facing each other and second sides parallel to an extension direction of the second fibers and facing each other.

Display device including support plate with opening

A window coating jig includes: a base part and a stage which includes a support part, a first sidewall part surrounding the support part and defining an outer wall, and a second sidewall part disposed between the support part and the first sidewall part, and protrudes from the base part, wherein a blow groove is defined between the first sidewall part and the second sidewall part, a suction groove is defined between the second sidewall part and the support part, the base part has a blow hole and a suction hole passing through the base part, the blow hole and the suction hole being defined therein, the blow hole overlaps the blow groove, the suction hole overlaps the suction groove, and the first sidewall part has a vent opening passing therethrough in a direction crossing the direction in which the blow hole extends, the vent opening being defined therein.

Coating apparatus for window and coating method using the same

An electronic device includes a display module, and a support plate disposed under the display module and comprising reinforced fibers having long axes arranged in parallel to a direction. The electronic device is divided into a folding area foldable with respect to a folding axis extending in the direction, and a non-folding area adjacent to the folding area.

An integrated circuit (IC) device includes a line structure including a conductive line formed on a substrate and an insulation capping pattern that covers the conductive line; an insulation spacer covering a sidewall of the line structure; a conductive plug spaced apart from the conductive line in a first horizontal direction with the insulation spacer between the conductive plug and the conductive line; a conductive landing pad arranged on the conductive plug to vertically overlap the conductive plug; and a capping layer including a first portion between the conductive landing pad and the insulation capping pattern, wherein the first portion of the capping layer has a shape in which a width in the first horizontal direction gradually increases as a distance from the substrate increases between the conductive landing pad and the insulation capping pattern.

Integrated circuit (IC) device

An electronic apparatus includes a first adhesive member having a first modulus, a second adhesive member having a second modulus, and a flexible member between, and contacting, the first adhesive member and the second adhesive member, wherein a stress relaxation of the first adhesive member is about 70% or less, and wherein an absolute value of a difference between the first modulus and the second modulus is about 0.01 MPa or less.

A semiconductor device includes a bit line structure on a substrate, a spacer structure including a first spacer directly contacting a sidewall of the bit line structure, a second spacer directly contacting a portion of an outer sidewall of the first spacer, the second spacer including air, and a third spacer directly contacting an upper portion of the first spacer and covering an outer sidewall and an upper surface of the second spacer, and a contact plug structure extending in a vertical direction substantially perpendicular to an upper surface of the substrate and directly contacting an outer sidewall of the third spacer at least at a height between respective heights of a bottom and a top surface of the second spacer.

Semiconductor device having bit line structure with spacer structure and method of manufacturing the same

A semiconductor device and methods of manufacturing the same are provided. The semiconductor device includes a substrate, buried semiconductor layers, a word line, a bit line, buried contacts, and insulation spacers, and a charge storage. The substrate has active regions and field regions. The buried semiconductor layers are buried in the substrate at the active regions. The word line is buried in the substrate and crosses one of the active regions. The bit line is disposed in one of the active regions. The buried contacts are disposed on the active regions and the field regions. The insulation spacers are disposed on the substrate and on a sidewall of the buried contacts, respectively. The charge storage is disposed on one or more of the buried contacts. The buried semiconductor layers contact, respectively, one of the buried contacts and one of the insulation spacers.

Semiconductor device and method of manufacturing the same

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Yongin-si, South Korea

Yong-kwan Kim