Cheil Industries Inc.

Yong Kook Kim

Woo-Han Kim

Sang-Ran Koh

Sung-Hwan Cha

Ha Neul Kim

Chi Won An

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si-Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Resin for transparent encapsulation material, and associated encapsulation material and electronic device

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si&#x2014;Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si&#x2014;Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si&#x2014;Vi) in the second polysiloxane is about 1 to about 1.

Growing community of inventors

Uiwang-si, South Korea

Yong Kook Kim