Eugene Technology Co., Ltd.

Samsung Electronics Co., Ltd.

Charmgraphene Co., Ltd.

Charmtron Co., Ltd.

Yong Ki Kim

Jae Woo Kim

Sung Tae Je

Yang Sik Shin

Jun Tae Kim

Chang Dol Kim

Byoung Gyu Song

Cha Young Yoo

Jun Jin Hyon

Ja Dae Ku

Bong Ju Jung

Kyung Bae Park

Kyu Hyun Choi

Jeong-Hoon Park

Min-Woo Lee

Hyun-Hee Park

Jong-Ho Kim

Se-hyeok Park

Byung-seok Min

Kyoung Soo Kim

Jong-man Kim

Ji-Young Yi

Sang Don Lee

Kyu Jin Choi

Kyong Hun Kim

Kyoung Hun Kim

Yo Se Eum

Eun-Hyun Kim

Kyung Seok Park

Sung Gyun Son

Tae Ho Lee

Dong Been Huh

In accordance with an exemplary embodiment of the present invention, an apparatus for processing substrate comprising: a support plate; an antenna disposed in parallel to one surface of the support plate and having 1st to n-th turns (n=an integer greater than 3) wound along one direction from an inner end; and a distance control unit capable of adjusting separation distances formed between the 1st to n-th turns.

Substrate processing apparatus

In accordance with an exemplary embodiment of the present invention, an assembly for supporting substrate, the assembly comprising: a support frame having at least one insertion hole recessed from one surface of the support frame, the insertion hole having an inner movement hole and a screw hole positioned outside the inner movement hole; and a substrate support member including a shaft body inserted into the insertion hole with one end of the shaft body and a pin shaft connected to the shaft body to support the substrate in contact, wherein the shaft body having an inner screw body inserted into the insertion hole and positioned in the inner movement hole and a connection body disposed between the inner screw body and the pin shaft and positioned in the screw hole, wherein the inner diameter of the screw hole is smaller than the diameter of the inner movement hole and the outer diameter of the inner screw body, the inner screw body is capable of passing through the screw hole by rotation.

Substrate support assembly and substrate processing apparatus

In accordance with an exemplary embodiment, a substrate processing apparatus includes: a tube assembly having an inner space in which substrates are processed and assembled by laminating a plurality of laminates, each of which includes an injection part and an exhaust hole; a substrate holder configured to support the plurality of substrates in a multistage manner in the inner space; a supply line connected to one injection part of the plurality of laminates to supply a process gas; and an exhaust line connected to one of a plurality of exhaust holes to exhaust the process gas, and the substrate processing apparatus that has a simple structure and induces a laminar flow of the process gas to uniformly supply the process gas to a top surface of the substrate.

A heat treatment apparatus for high-quality graphene synthesis comprises an upper roll chamber, a deposition chamber connected to the upper roll chamber to deposit graphene on a catalytic metal film, and a lower roll chamber mounted on a lower portion of the deposition chamber. The upper roll chamber includes a supply roller and the lower roll chamber includes a lower direction shifting roller shifting a direction of the catalytic metal film supplied from the supply roller. In the deposition chamber, a catalytic metal film at a supply side transferred from the supply roller to the lower direction shifting roller and a catalytic metal film at a discharge side transferred from the lower direction shifting roller to a winding roller are passed, and a heater portion is mounted around the catalytic metal film at the supply side and the catalytic metal film at the discharge side.

Heat treatment apparatus for high-quality graphene synthesis

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

Apparatus for sawing a semiconductor package

In accordance with an exemplary embodiment, a substrate processing apparatus includes: a tube assembly having an inner space in which substrates are processed and assembled by laminating a plurality of laminates, a substrate holder configured to support the plurality of substrates in a multistage manner in the inner space of the tube assembly, a gas supply unit installed on one side of the tube assembly to supply a process gas to each of the plurality of substrates in the inner space; and an exhaust unit connected to the tube assembly to exhaust the process gas supplied into the inner space, the substrate processing apparatus that induces a laminar flow to supply a uniform amount of process gas to a top surface of the substrate.

Substrate processing apparatus and method for assembling tube assembly

The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus that is capable of improving a flow of a process gas that is participated in a substrate processing process and a substrate processing method using the same. The substrate processing apparatus in accordance with an exemplary embodiment includes a pre-chamber into a substrate is carried, a process chamber communicating with the pre-chamber and in which a substrate processing process is performed, a substrate boat including a plurality of partition plates that partition a loading space into which the substrate is loaded and to elevate, a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber, an exhaust unit configured to exhaust a gas through a plurality of suction holes defined in the process chamber, and a swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates.

Substrate processing apparatus and substrate processing method using the same

A method for transferring graphene according to an exemplary embodiment of the present invention includes a process of transferring graphene of a metal sheet onto a thermal release film in each vacuum chamber and a process of transferring the graphene of the thermal release film onto a base material substrate. According to the method for transferring graphene, adhesion is increased by removing bubbles or foreign substances at the time of transferring the graphene to prevent separation of the graphene at the time of etching a metal substrate and enhance an adhesive quality state of the graphene on a target substrate.

Method for transferring graphene

The present disclosure relates to a substrate processing apparatus, and more particularly, a substrate processing apparatus that is capable of improving process uniformity on an entire surface of a substrate. The substrate processing apparatus includes a substrate boat in which a substrate is loaded, a reaction tube in which a processing process for the substrate loaded in the substrate boat is performed, a gas supply unit configured to supply a process gas into the reaction tube through an injection nozzle disposed on one side of the reaction tube, a heating unit including a plurality of vertical heating parts, which are disposed along a circumference of the reaction tube outside the reaction tube and configured to divide the circumference to the reaction tube into a plurality of portions so as to independently heat each of the divided portions of the reaction tube, and a control unit configured to control the heating unit.

Provided is a substrate processing apparatus including a tube having an inner space therein, a substrate supporting unit including a plurality of isolation plates configured to vertically stack a plurality of substrates thereon and divide a processing space, in which the plurality of substrates are processed, into a plurality of processing spaces in the tube, a gas supply unit configured to supply a processing gas to the plurality of substrates, and an exhaust unit disposed to face the gas supply unit to exhaust a gas inside the tube. A plurality of through-holes are defined in each of the isolation plates.

The present invention may include: a tube providing an interior space in which substrates are processed; a substrate support portion stacking a plurality of substrates in the interior space of the tube in multi-level; a gas supply portion supplying a process gas to the plurality of substrates; an exhaust portion disposed to face the gas supply portion to absorb the process gas; and a flowage adjustment portion having spray openings formed along a circumference of the tube between the gas supply portion and the exhaust portion to spray an adjusting gas, and may be capable of controlling the amount of process gas supplied to an upper surface of the substrate by adjusting the flowage of process gas.

A display method and a display device for optimizing screen brightness of a mobile terminal are provided. The display method includes: determining an external illuminance value based on a sensor signal by detecting by the sensor signal for determining a brightness value of a screen; determining the brightness value of the screen corresponding to the external illuminance value; and outputting an image signal by using the brightness value of the screen.

Growing community of inventors

Osan-si, South Korea

Yong Ki Kim