Semes Co., Ltd.

Yong-Jun Seo

Sang Hyun Son

Young Seop Choi

Sun Yong Park

Sang Min Lee

Young Hun Lee

Pil Kyun Heo

Jaeseong Lee

Hyun Yoon

Jae Myoung Lee

Miso Park

Doyeon Kim

Youngseop Choi

Jong Hyeon Woo

Ji Su Hong

Dong Ok Ahn

Youngje Um

Bok Kyu Lee

Ji Young Lee

Yerim Yeon

Byeong Geun Kim

Yoonki Sa

Jun Gwon Lee

Dongok Ahn

Jungsuk Goh

Choonghyun Lee

Hak Hyon Kim

Hwan Bin Kim

Gyeong Ryul Kim

A substrate type sensor includes a substrate shape member, a pressure sensor panel provided at the substrate shape member, the pressure sensor panel including a plurality of pressure sensors, a central module including a transmission unit, the reception unit receiving data from the pressure sensor panel, and a battery proving power to the pressure sensor panel and the central module.

Substrate type sensor and method of measuring the impact point and the impact force of chemical

A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.

Substrate type sensor for measuring horizontality of substrate support member provided in atmosphere accompanied by temperature change, method for measuring horizontality of substrate support member by using the same, and non-transitory computer readable medium

The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

Method and apparatus for treating substrate

A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

Buffer unit and method for storaging substrate type sensor for measuring of horizontality of a substrate support member provided on a temperature varying atmosphere

The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.

Apparatus for treating substrate

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

Wafer type sensor unit and data acquisition method using the wafer type sensor unit

Growing community of inventors

Hwaseong-si, South Korea

Yong-Jun Seo