Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Other

Yong Jun Choi

Seok Hoon Kim

Seung Min Shin

Ji Hoon Cha

Kun Tack Lee

In Gi Kim

Jinwoo Lee

Hun Jae Jang

Young-Hoo Kim

Tae-Hong Kim

Yun Sik Jang

Sung Moon Cho

Sung Jong Oh

Sang Ho Lee

Jin Woo Lee

In Gun Kim

Sung Hyun Park

Young Geun Lee

Mi Yeon Park

Kwang Hee Shin

Jung Min Oh

Yong Jhin Cho

In Kwang Bae

An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.

Method of manufacturing semiconductor device using stationary laser module

A wet etching apparatus includes a process bath having an internal space configured to receive an etchant and having a support unit, on which a wafer is disposed to be in contact with the etchant. A laser unit is disposed above the process bath and is configured to direct a laser beam to the wafer and to heat the wafer thereby. An etchant supply unit is configured to supply the etchant to the internal space of the process bath.

Wet etching apparatus

A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

Wafer cleaning apparatus and wafer cleaning method using the same

A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

Multi-chamber apparatus

Semiconductor device manufacturing apparatus including laser module

A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

Wafer cleaning equipment

A method of predicting membrane fouling in a reverse osmosis process includes collecting information relative to the reverse osmosis process being performed over a predetermined period of time, the collected information including a process factor and a water quality factor, the process factor including a produced water flow rate; calculating a salt removal rate and a pressure drop based on the collected information; normalizing the produced water flow rate, the salt removal rate, and the pressure drop; generating a prediction equation using normalized values of the produced water flow rate, the salt removal rate, and the pressure drop values; and predicting membrane fouling through the generated prediction equation to determine a chemical cleaning time. Process and water quality factors are normalized to temperature and/or flow rate, and the prediction equation uses the normalized factors. Both short-term and long-term predictions are made for chemical cleaning time and membrane module replacement time.

Method of predicting membrane fouling in reverse osmosis process

The present disclosure relates to a device and a method for removing a carbon from an oxygen sensor. The device may include an oxygen sensor installed in a gas exhaust line of a vehicle to measure an oxygen content in an exhaust gas, a valve for transferring a high-pressure air flow to the oxygen sensor, a valve actuator for driving the valve, and a controller for controlling the valve actuator to open the valve when an abnormality occurs in the oxygen sensor. When the abnormality has occurred in the oxygen sensor, the valve for transferring the high-pressure air flow is opened, and a temperature of zirconia provided in the oxygen sensor is raised to remove a carbon deposited on the oxygen sensor.

Device and method for removing carbon from oxygen sensor

A device for preventing dilution of engine oil includes an oil pan in which oil for lubrication of the engine is recovered with fuel. An exhaust purifier is provided on a rear end of the engine and purifying exhaust gas. A gas passage can guide flow of exhaust gas passing through the exhaust purifier to the oil pan. A gas valve can control flow rate of the exhaust gas flowing in the gas passage. A controller controls an opening ratio of the gas valve depending on a temperature of oil inside the oil pan to maintain the temperature of the oil equal to or higher than a temperature at which the fuel in the oil pan is vaporized.

Device for preventing dilution of engine oil

A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.

Chemical liquid supply apparatus and semiconductor processing apparatus having the same

Growing community of inventors

Gwacheon-si, South Korea

Yong Jun Choi