Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

International Business Machines Corporation

Samsung Sdi Co., Inc.

Ajou University Industry-academic Cooperation Foundation

Wits Co., Ltd.

Korea Food Research Institute

Yong Jong Park

Ki Pyo Hong

Sim Chung Kang

Jong Ho Lee

Ji Hong Jo

Woo Chul Shin

Jeong Su Han

Joonmyoung Lee

Jin Tae Jeong

Eun Jung Lee

Jang Yeol Lee

Kook Jeong Seo

Do Yun Jang

Han Jun Sung

Chang Ik Kim

Jae Suk Sung

Seung Won Park

Bong Su Son

Sang Beom Lee

Yoon Young Kim

Jong Sung Park

Sang Ho Cho

Boo Keun Yoon

Jae Hyoung Cho

Hwi Dae Kim

Young Gwan Ko

Myung Sam Kang

Eung Ryeol Seo

Ung Hwan Pi

Eun Young Shin

Jung Tae Park

Moon Gyo Jung

Hyun Min Cho

Jae Yeol Choi

Jae Seung Lee

Ji-Young Lee

Sechung Oh

Jong Hwa Lee

Juhyun Kim

Hyung Soon Kwon

Jeong-Heon Park

Hoon Do Heo

Chang Soo Park

Hye Young Choi

Eunsun Noh

Ki Woong Kim

Won Seob Oh

Jun Hoe Choi

Jeoung Kyo Jeoung

Jong Hoon Kim

Sang Hoon Lee

Dong Hwan Lee

Jin Su Kim

Ji Young Kim

Min Woo Kim

Ki Won Chang

Sang Min Park

Han-Soo Kim

Jeong Ho Lee

Woojin Kim

Jung Won Lee

Jung Seok Lee

Sang Yeon Pyo

Chul Gyun Park

Jung Hee Lee

Hee Soo Yoon

Soo-cheol Lee

Sang Kyu Lee

Ji Hoon Choi

Jae Hyuk Lee

Stuart S P Parkin

Sang Hwan Cho

Hwan Soo Lee

Woo Chang Lim

Jae Ryong Park

Ki Hwan Kwon

Joon Yong Park

Ji-young Lee

Jung Soo Lim

Shin Young Cheong

Jae Ho Baik

Jong Su Jeon

Moon Il Kim

Yong Han Kim

Sung Min Song

Se Chung Oh

Keewon Kim

Hyung Wook Cho

Chang Soo Kang

Sung Heum Park

Hyun Mook Kim

Jung Wook Hwang

Chang Hak Lim

Dong Pil Seo

Sun Gyou Lee

Il Kweon Joung

Tae Shik Shon

Seon Hee Moon

In Sub Lee

Kyoung Mok Kim

A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.

Multilayer electronic component and method of manufacturing multilayer electronic component

A cooking apparatus includes a cooking chamber, a cooking plate having a visual representation distinguishing a plurality of areas on a top surface of the cooking plate, a plurality of heaters configured to supply heat to the plurality of areas and a controller configured to receive information about a cooking object including a plurality of pieces of food having different cooking conditions, based on the information about the cooking object, determine a first heating intensity to be used to heat the first piece of the food, and a second heating intensity to be used to heat the second piece of the food, control the plurality of heaters to supply heat of the first heating intensity to the first area, and control the plurality of heaters to supply heat of the second heating intensity to the second area.

Cooking apparatus and method of controlling the cooking apparatus

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).

Multilayer capacitor and board having the same mounted thereon

A multilayer ceramic capacitor includes a ceramic body including dielectric layers, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion respectively arranged on end portions of the internal electrodes exposed to first and second surfaces. The first and second side margin portions each include a first region adjacent to an outward facing side surface of the respective side margin portion, and a second region adjacent to the internal electrodes exposed to the first and second surfaces of the ceramic body, and an average size of dielectric grains included in the second region is larger than an average size of dielectric grains included in the first region.

Multilayer ceramic capacitor and method of manufacturing the same

A capacitor component includes a body having a stacked portion in which first internal electrodes and second internal electrodes are alternately stacked with each other and with dielectric layers therebetween in a first direction, and having first and second connection portions disposed on opposite surfaces of the stacked portion, respectively, in a second direction perpendicular to the first direction. First and second external electrodes are disposed on the first and second connection portions, respectively. The first and second connection portions each include a metal layer disposed on the stacked portion and a ceramic layer disposed on the metal layer. Corners of the body have a rounded shape in a cross-section of the body extending in the first and second directions.

Capacitor component including connection portion between external electrode and body

A multilayer capacitor includes: a capacitor body including first and second internal electrodes alternately stacked with a dielectric layer interposed therebetween, and having first to six surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, the second internal electrode being exposed through the fourth, fifth, and sixth surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body; and first and second external electrodes. The capacitor body includes upper and lower cover portions disposed on an upper surface of an uppermost internal electrode and a lower surfaces of a lowermost internal electrode, respectively, in a stacking direction of the first and second internal electrodes. The first and second side portions and the upper and lower cover portions include zirconium (Zr).

Multilayered capacitor and board having the same mounted thereon

A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.

Capacitor component including reinforcing pattern in a margin/cover portion

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: 

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same

A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.

Capacitor component

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

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Seongnam-si, South Korea

Yong Jong Park