Nanjing Medical University

The 58th Research Institute of China Electronics Technology Group Corporation

Yong Ji

Shuang Zhao

Liping Xie

Chongchong Mao

Tianyu Song

Rongzhen Zhang

Yi Han

Disclosed are a thiazolone derivative of N6022 and a pharmaceutical use thereof. The characteristic structure of the thiazolone derivative of N6022 is: Compared to N6022, the compound of the present disclosure has good oral bioavailability and a longer half-life period. In in-vitro experiments, administering the compound of the present disclosure can improve migration ability, tube formation ability and, the permeability of human umbilical vein endothelial cells caused by high glucose, and administering the compound of the present disclosure at an animal level can obviously promote the angiogenesis and blood flow recovery of ischemic lateral limbs of diabetic mice. Overall, it suggests that the compound of the present disclosure can be used for treating diseases related to diabetic vascular complications.

Oral GSNOR inhibitor and pharmaceutical use thereof

A fan-out wafer level multilayer wiring package structure, wherein the package structure comprises a plurality of semiconductor chips, a multilayer interposer, a vertical interconnection interposer, molding materials and a redistribution layer; the back surface of the semiconductor chip is bonded to the back surface of the multilayer wiring interposer with the bonding material, and is placed on the same horizontal plane as the vertical interconnection interposer and packaged as a whole with the molding material, the redistribution layer is provided on the surface of the structure; the semiconductor chip, the multilayer interposer, the conductive material of the vertical interconnection interproser and the solder ball are connected by the conductive metal layer of the redistribution layer to achieve the signal interconnection between the semiconductor chip and the multilayer interposer and the I/O signal transfer of the semiconductor chip.

Fan-out wafer level multilayer wiring package structure

Growing community of inventors

Jiangsu, China

Yong Ji