Samsung Electronics Co., Ltd.

Hanmi Pharm. Co., Ltd.

Lg Electronics Inc.

Samsung Display Co., Ltd.

Oci Company Ltd.

Hanmi Science Co., Ltd.

Institute of Ion-plasma and Laser Technologies

Institution of Ion-plasma and Laser Technologies

D C Chemical Co., Ltd.

Gomyung-enertech Co., Ltd.

Yong Il Kim

Sung Hyun Sim

Jae Hyun Park

Wan Tae Lim

Jong Soo Woo

Ji Hye Yeon

Han Kyu Seong

Nam Goo Cha

Hanul Yoo

Dong Gun Lee

Sung Gue Lee

Jin Sub Lee

Young Soo Park

Hye Seok Noh

Ho Taek Im

Ha Nul Yoo

Young Jin Choi

Su Hyun Jo

Kyeong Soo Kim

Jin Cheul Kim

Taek Kwan Kwon

Hyong Sik Won

Jung Sub Kim

Jong In Yang

Ji Hoon Yun

Se In Yang

Deok Yun Kim

Tae Hun Kim

Dong Ho Kim

Su Yeol Lee

Young Hwan Kim

Tan Sakong

Yo Han Kim

Tae Sung Jang

Yung Ho Ryu

Kyung Y Kim

Seung Wan Chae

Jong Uk Seo

Wee Joon Jeong

Yong Soon Jang

Jun Bu Youn

Hyun Kwon Hong

Kwang Min Song

Sang Jin Kong

Se Jun Han

Sung Sik Cho

Salikhov Shavkat

Ashurova Khekayat

Kyung Keun Yoo

Yu Seock Yang

Taek Joong Kim

Joo Sung Kim

Seung Jae Park

Jae Hwan Chun

Young Keun Choi

Ho Taek Yim

Ho Sung Choi

Ashurov Khatam

Rotshteyn Vladimir

Young Su Yoon

Azizov Sultan

Sung Tae Kim

Seung Jae Lee

Mu Gyeom Kim

Min Jung Kim

Jung Soo Kim

Seul Gee Lee

Jung Hyun Cho

Chang Yong Jeong

Myong Soo Cho

Jong In Kim

Bo Kyung Kim

Jong Rak Sohn

Ho Young Song

Ju Heon Yoon

Ji Hwan Hwang

Sung Joon Kim

Jun Young Choi

Young Jo Tak

Deokkyu Lee

Byoung Ha Cho

Chung Sun Lee

Hyung Duk Ko

Won Hyung Lee

Cheol Ho Shin

Sang Tae Sim

Sang Hyeok Lee

Eun Joo Shin

Su Min Hwangbo

Ji Hyun Im

Do Sun Baik

Caleb Hyung Min Park

Shanmugam Srinivasan

Myoung Ki Jeong

Hyuk Jun Cho

Young Jun Na

Kurbanov Aziz

Abdisaidov Ilyos

Seung Hun Chang

A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

Semiconductor light emitting device

A method of manufacturing a semiconductor light emitting device, the method including forming a first conductivity-type semiconductor layer on a substrate; forming an active layer on the first conductivity-type semiconductor layer; forming a mask layer having an opening on the active layer; growing a second conductivity-type semiconductor layer through the opening; removing the mask layer; removing a portion of the active layer and a portion of the first conductivity-type semiconductor layer that do not overlap the second conductivity-type semiconductor layer; and removing a portion of the first conductivity-type semiconductor layer to expose the substrate.

Method of manufacturing semiconductor light emitting device

In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter. Exemplary display panels and methods of manufacturing semiconductor devices and display panels are also disclosed.

Light emitting diode module, display panel having the same and method of manufacturing the same

An oral solid formulation includes irinotecan or a pharmaceutically acceptable salt thereof as an active ingredient, and an acidifying agent.

Oral solid formulation containing irinotecan and method of preparing the same

Provided are a composite capsule and a method of preparing the composite capsule. The composite capsule includes a first dissolving part including a core, an inner coating layer on the core, and a first enteric coating layer on the inner coating layer, wherein core contains, as an active ingredient, esomeprazole or a pharmaceutically acceptable salt thereof. The composite capsule further includes a second dissolving part including a core, which contains, as an active ingredient, esomeprazole or a pharmaceutically acceptable salt thereof, an inner coating layer on the core, and a second enteric coating layer on the inner coating layer.

Esomeprazole-containing complex capsule and preparation method therefor

A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

Method of fabricating light emitting device package

A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.

Light emitting diode display device

Disclosed is a pharmaceutical formulation containing esomeprazole or a pharmaceutically acceptable salt thereof. The pharmaceutical formulation, based on considerably improved pH-dependent drug release characteristics, starts to release the esomeprazole or a pharmaceutically acceptable salt thereof at a target delay time after oral administration, continues the release for a predetermined time, and finishes the release after a predetermined time, thereby providing excellent patient convenience and excellent therapeutic effects, as compared to conventional other formulations.

Formulation having improved pH-dependent drug-release characteristics, containing esomeprazole or pharmaceutically acceptable salt thereof

A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.

Light emitting device package

A light emitting diode display device is provided. The light emitting diode display device includes a first light emitting diode pixel including a first light emitting diode layer and a first color conversion material on the first light emitting diode layer, a second light emitting diode pixel including a second light emitting diode layer and a second color conversion material on the second light emitting diode layer, a separation film disposed between the first light emitting diode layer and the second light emitting diode layer and a partition disposed between the first color conversion material and the second color conversion material and including a partition material, wherein the first and second light emitting diode pixels are divided by the separation film and the partition, the partition is disposed on the separation film in alignment with the separation film such that the partition includes linear portions that extend in a first direction and the separation film includes linear portions that also extend in the first direction and vertically overlap the linear portions of the partition, and the partition material includes an insulating material different from silicon.

Light emitting diode display device with separation film and partition aligning to each other

A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

Method of manufacturing display module using LED

A light emitting device package includes a light emitting structure including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first to third light emitting cells including an active layer to emit light of a first wavelength in a first direction and being separated from each other in a second direction, orthogonal to the first direction, a first light adjusting portion including a first wavelength conversion layer in a first recess portion of the first light emitting cell, the first wavelength conversion layer to convert light of the first wavelength to light of a second wavelength, and a second light adjusting portion including a second wavelength conversion layer in a second recess portion of the second light emitting cell, the second wavelength conversion layer to convert light of the first wavelength to light of a third wavelength.

A method of manufacturing a light emitting device includes forming light emitting devices on a support portion, each of the light emitting devices including first to third light emitting cells respectively emitting light of different colors; supplying test power to at least a portion of the light emitting devices using a multi-probe; acquiring an image from the light emitted from the portion of the light emitting devices to which the test power is supplied using an image sensor; identifying normal light emitting devices of the portion of the light emitting devices by determining whether a defect is present in each of the light emitting devices of the portion of the light emitting devices by comparing the image acquired by the image sensor with a reference image; and based on the identifying step, measuring optical characteristics of each of the light emitting devices identified as normal of the portion of the light emitting devices.

Method of manufacturing light emitting device

A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.

Light emitting device package including light emitting devices, light-transmissive substrate, and eutectic bonding layer interposed therebetween and display device using the same

Growing community of inventors

Seoul, South Korea

Yong Il Kim