Samsung Electronics Co., Ltd.

Yong-hun Kwon

Young-chan Kim

Chang-rok Moon

Young-gu Jin

Tae-sub Jung

A 3D image sensor include a depth pixel and at least two polarization pixels adjacent to the depth pixel. The depth pixel includes a charge generation region in a substrate. The depth pixel is configured to generate depth information associated with a depth of an object from the 3D image sensor in a 3D scene based on detecting light reflected from the object. Each polarization pixel includes a photodiode in the substrate and a polarizer on the substrate in a light-incident direction. The polarization pixel is configured to generate shape information associated with a shape of a surface of the object in the 3D scene based on detecting light reflected from the object. The polarization pixels and the depth pixel collectively define a unit pixel. The respective polarizers are associated with different polarization directions.

Three-dimensional (3D) image sensors including polarizer, and depth correction methods and 3D image generation methods based on 3D image sensors

A method of verifying the layout of an integrated circuit device is provided. In a method of verifying the layout of an integrated circuit device having a memory block, a dummy circuit for receiving and outputting signals which are applied to the input and output ports included in the memory block, is inserted into the memory block. Then, the integrated circuit device is placed and routed using a computer. Next, a circuit-to-layout verification is performed with respect to the integrated circuit device, using a computer. Thus, the time for layout data verification with respect to the integrated circuit device is shortened and the verification made more accurate.

Growing community of inventors

Hwaseong-si, South Korea

Yong-hun Kwon