Korea Institute of Industrial Technology

Korea Advanced Institute of Science and Technology

Korea Electronics Technology Institute

Hoseo University Academic Cooperation Foundation

Mk Electron Co., Ltd.

Sin Yeong Co., Ltd.

Yong Ho Ko

Chang Woo Lee

Jung Hwan Bang

Jae Hong Lee

Jeong Han Kim

Hui Jung Kim

Jeong Tak Moon

Sung Jae Hong

Jun Ki Kim

Jae Won Chang

Young Woo Lee

Se Hoon Yoo

Won Sik Hong

Hyuck Mo Lee

Jong Dock Seo

Dea Keun Kim

Kwang Woo Won

Ja Hyun Koo

Keun Soo Kim

The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Airbag sensor module and car body integrated with airbag sensor module

Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Lead free solder bumps

Growing community of inventors

Incheon, South Korea

Yong Ho Ko