East China University of Science and Technology

Huawei Technologies Co., Limited

Shanghai Fuyuan Rubber and Plastic Technology Ltd.

Shanghai Sujie Science-technology Co. Ltd.

Yong Guan

Anna Zheng

Dafu Wei

Xiaodong Zhang

Hong Lu

Tonglong Zhang

Jian Zhang

Xiang Xu

Pengfei Zhan

Heng Li

Han Shi

Fuzeng Hu

Shuzhong Wang

Weixing Liu

Simin Wang

A chip package on package structure includes a primary chip stack unit having pins insulated and spaced from each other on a first surface; a first bonding layer disposed on the first surface, where the first bonding layer includes bonding components insulated and spaced from each other, each bonding component includes a bonding part, and any two bonding parts are insulated and have a same cross-sectional area, and the bonding components are separately bonded to the pins; and secondary chip stack units, disposed on a surface of a side that is of the first bonding layer and that is away from the primary chip stack unit, where the secondary chip stack unit has micro bumps insulated and spaced from each other, and each of the micro bumps is bonded to one of the bonding components.

Chip package on package structure, packaging method thereof, and electronic device

A chip package structure includes a first chip, a second chip, and a carrier board. The first chip is disposed between the second chip and the carrier board. An active layer of the first chip is opposite to an active layer of the second chip. A first interconnection structure is disposed between the first chip and the second chip and is configured to couple the active layer of the first chip to the active layer of the second chip. A first conductor pillar is disposed in the first chip. One end of the first conductor pillar is coupled to the active layer of the first chip, and the other end of the first conductor passes through the first chip to be coupled to a circuit in the carrier board.

Chip package structure and chip packaging method

A method of reactive extrusion copolymerization of vinyl monomer consisting of (1) feeding vinyl monomer or at least one vinyl monomer together with an initiator into the first screw of twin-screw extruder, and modified resin into the subsequent screw section; (2) feeding the above monomer into the screw segment after auto-acceleration zone and feeding the initiator corresponding to the temperature of barrel and micro/nano inorganic modified fillers after the half-life period of the initiator; (3) feeding the antioxidant and anti-UV agent at the end of the polymerization, and then removing unpolymerized monomer and by-products by devolatilization of screw segment; (4) obtaining vinyl copolymer resin with a anticipated molecular weight of 5&#xd7;102 to 6&#xd7;105 from the reactive extrusion polymerization by controlling the temperature of different screw segments. The invention which overcomes the existing defects of the free radical polymerization by reactive extrusion technology, can not only meet the requirement of short stay time of reactive extrusion polymerization, combine the functionalization and high performance, but also make it possible to obtain high molecular weight polymers.

Method of reactive extrusion copolymerization of vinyl monomers

This invention deals with an approach to control anionic polymerization. The anionic polymerization is conducted by adding a kind of initiator ligand compound, directly or in the form of solution into the monomer or initiator at the same or different time, or at different stages. The metal atoms in the ligand can form the association with the initiator cations, while the alkyloxy groups in the initiator ligand can restrict the entering channel of the addition of the monomers due to their relatively large volume or steric hindrance. Therefore, the initiator ligand compound can restrict the rate of anionic polymerization, restrain the side reaction, and make the anionic polymerization possible to be conducted at room or even higher temperature. The molar ratio of initiator ligand compound to initiator is from 0.01:1 to 20:1. Compared with present technologies, the method of this invention can control and adjust the homopolymerization and copolymerization rate, side reactions and the polymerization temperature, and make it possible to industrialize.

Method for controlling anionic polymerization

The present invention belongs to the field of polymerization and processing of polymer and relates to the preparation of a kind of functional polyolefin master batch. The functional master batch is produced by liquid phase, melt phase, or solid phase reaction after mixing the polyolefin resin, polyamine and guanidine salt oligomer, olefin monomer and initiator. The molecular structure of functional polyolefin master batch is shown below:  Blending mentioned functional master batch with the corresponding polyolefin, the various antimicrobe products, such as fibers, film, pipe and other plastic articles can be obtained. Besides endowing products with excellent permanent antimicrobe property, it also provides fibers with good-dyeable and antistatic ability and bumpers with easy-paintable ability.

Preparation method of functional master batch of polyolefin and its application

The present invention belongs to the field of polymerization and processing of polymer and relates to the preparation of a kind of functional polyolefin master batch. The functional master batch is produced by liquid phase, melt phase, or solid phase reaction after mixing the polyolefin resin, polyamine and guanidine salt oligomer, olefin monomer and initiator. The molecular structure of functional polyolefin master batch is shown below:  wherein R is a polyamine and guanidine salt oligomer bonded onto polyolefin molecular chain by covalence bond, while S is one selected from hydrogen, chlorine, methyl, or phenyl group. Blending mentioned functional master batch with the corresponding polyolefin, the various antimicrobe products, such as fibers, film, pipe and other plastic articles can be obtained. Besides endowing products with excellent permanent antimicrobe property, it also provides fibers with good-dyeable and antistatic ability and bumpers with easy-paintable ability.

Growing community of inventors

Shanghai, China

Yong Guan