Samsung Electronics Co., Ltd.

Kabushiki Kaisha Yaskawa Denki

Yong-Gu Kang

Jong-Hyun Choi

Dong-Il Seo

Young-Hun Seo

Jung-yong Choi

Katsuhiko Shimada

Nobuyuki Furukawa

Joseph Chang

A substrate support device includes a blade and at least one pad provided on the blade to support a substrate. The pad includes a first fixed member, a second fixed member, and a bridge. The first fixed member is provided at an outer portion of the blade. The outer portion is located outside an outer circumference portion of the substrate when the substrate is supported on the pad. The second fixed member is provided at an inner portion of the blade. The inner portion is under the substrate when the substrate is supported on the pad. The bridge is flexible and connects the first fixed member and the second fixed member to support the outer circumference portion of the substrate. An upper surface of the bridge is inclined downward from the first fixed member toward the second fixed member when the substrate is not supported on the pad.

Substrate support device, substrate conveyance robot, and aligner device

A temperature sensor instruction signal generator, which may drive a temperature sensor, and a semiconductor memory device including the same. The temperature sensor instruction signal generator may generate an instruction signal that instruct the operation of the temperature sensor using at least one of a master clock (CLK) signal, a clock enable (CKE) signal, a row address selection (RAS) signal, a column address selection (CAS) signal, a write enable (WE) signal, and a chip selection (CS) signal, wherein the instruction signal may be enabled corresponding to at least one of a self refresh mode, an auto refresh mode, and a long tRAS mode. The semiconductor memory device may include a temperature sensor and the temperature sensor instruction signal generator.

Temperature sensor instruction signal generator and semiconductor memory device having the same

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Seoul, South Korea

Yong-Gu Kang