Lg Electronics Inc.

Yong-Dol Park

Jung-Sik Park

Eon-Pyo Hong

Dong-Koo Shin

Hyeong-Kook Lee

Jin-Young Jung

In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.

Growing community of inventors

Gyeonggi-do, South Korea

Yong-Dol Park