Stmicroelectronics Gmbh

National University of Singapore

Yong Chen

David Gani

Poh Seng Lee

Navin Raja Kuppusamy

Matthew Lee Liong Law

A multi-chip package including a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first side having a first conductive layer, a second side having a second conductive layer, and an edge, the first conductive layer coupled to the second conductive layer at a location adjacent to the edge. The second integrated circuit is coupled to the second conductive layer of the first integrated circuit.

Multi-chip package

A server (), a server rack () and a data centre () are provided. The server () includes a housing () defining a gaseous flow passage. A plurality of active components () and a plurality of passive components () are provided in the housing (). A plurality of liquid cooling devices () is attached to respective ones of the active components ().

Server rack and data center including a hybrid-cooled server

The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.

Growing community of inventors

Singapore, Singapore

Yong Chen