United Microelectronics Corp.

Yong Bin Fan

Chih-Chien Chang

Hui Ying Yang

Jianjun Yang

Chow Yee Lim

Zhi Qiang Mu

A manufacturing method of a semiconductor structure includes the following steps. A first polysilicon layer is formed on a substrate. A planarization process to the first polysilicon layer is performed. A first etching back process to the first polysilicon layer is performed after the planarization process. A second etching back process to the first polysilicon layer is performed after the first etching back process. A first wet clean process to the first polysilicon layer is performed after the first etching back process and before the second etching back process.

Growing community of inventors

Singapore, Singapore

Yong Bin Fan