Cyoptics (israel) Ltd.

Other

Siklu Communication Ltd.

Cyoptics Ltd.

Yonatan Biran

Yigal Leiba

Elad Dayan

Amir Shmuel

Baruch Schwarz

David Finzi

Dov Herstein

Uziel Koren

A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1&#x3e;Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2&#x3e;Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Impedance matching between a bare-die integrated circuit and a transmission line on a laminated PCB

A transition piece for coupling a coaxial transmission line to a printed circuit (PC) transmission line. The transmission line terminates in a conductive pin projecting through a conductive coaxial ground plane. The transition piece consists of a conductive plate which is adapted to be fixed between the coaxial ground plane and a PC ground plane of the PC transmission line. The plate is in electrical contact with both the coaxial and PC ground planes while the conductive pin contacts a conductive strip of the PC transmission line. Furthermore, the plate has an opening which is shaped and aligned with the pin so that a transition-impedance of the transition piece is substantially equal to a line impedance of the coaxial and PC transmission lines.

Transition from a coaxial transmission line to a printed circuit transmission line

An optical radiation amplifier, including an input port which receives the optical radiation and a first semiconductor optical amplifier (SOA), which is coupled to receive the optical radiation from the input port and is adapted to amplify the optical radiation to produce amplified optical radiation in response to a first current injected into the first SOA. The amplifier also includes an electro-absorption modulator (EAM), which is coupled to receive the amplified optical radiation and is adapted to modulate the amplified optical radiation in response to a modulation voltage applied to the EAM so as to produce modulated radiation. There is a second SOA, which is coupled to receive the modulated radiation and is adapted to amplify the modulated radiation in response to a second current injected into the second SOA.

Hybrid optical transmitter with electroabsorption modulator and semiconductor optical amplifier

An electro-optical assembly, consisting of an optical sub-assembly and a transmission line. The optical sub-assembly consists of an electro-optical component having an optical region and a first and a second electrode coupled thereto, and a conductive optical bench in contact with the second electrode of the electro-optical component, the optical bench being adapted to permit optical alignment of the electro-optical component while making such contact. The transmission line consists of a live conductor, a ground conductor insulated from the live conductor, and a port adapted to receive a signal. The live and ground conductors are coupled to the first and second electrodes of the electro-optical component so as to convey the signal between the port and the electro-optical component and to provide a direct current (DC) bias level to the electro-optical component independent of the signal.

Biasing of an electro-optical component

Growing community of inventors

Timrat, Israel

Yonatan Biran