Lg Innotek Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Yon Tae Moon

Yun Soo Song

Byung Mok Kim

Young Jun Cho

Su Jung Jung

Seo Yeon Kwon

Kwang Kyu Choi

Son Kyo Hwang

Hiroshi Kodaira

Hwan Hee Jeong

Koh Eun Lee

Ga Yeon Kim

Eun Seon Lee

Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.

Light emitting device package and light unit

According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Light-emitting device and lighting device having same

Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.

Light emitting device package and lighting system including the same

A light emitting module is disclosed. The light emitting module includes a circuit board, a plurality of light emitting devices mounted on the circuit board and spaced apart from each other, molding parts wrapping the respective light emitting devices, and a reflective member disposed on the circuit board to surround the light emitting devices. The reflective member has a height greater than that of each of the molding parts. The reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board.

Light emitting module and illumination system including the same

Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.

Light emitting device package, light source module, and lighting system including the same

Growing community of inventors

Seoul, South Korea

Yon Tae Moon