Honda Motor Co., Ltd.

Yoko Yamaji

Shigeto Akahori

Satoshi Hasegawa

Hiroyuki Yamagishi

Shinyu Hirayama

Hitoshi Saito

Nobuo Kambara

Koichiro Sato

Shinya Maita

Machie Saitou

A semiconductor inspection device () equipped with a contacting unit () having a contacting side surface () electrically contacting a semiconductor element (), and which inspects the semiconductor element () by making the contacting unit () electrically contact the semiconductor element (). The contacting side surface () is provided with a plurality of projecting units (), and the semiconductor element inspection device () is equipped with a hitting mark detecting unit () configured to detect hitting marks of the projecting unit () transferred to the semiconductor element () when the contacting side surface () contacts the semiconductor element (), and a control unit () configured to determine whether or not an inspection of the semiconductor element () is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit ().

Semiconductor element inspection device and inspection method

Provided is a current application device capable of applying a test current of a magnitude necessary for testing of a semiconductor element without any trouble. A current application deviceis configured to have a contacting section having a plurality of projectionsfor contacting a contact regioninside an active regionof a semiconductor elementand applying the test current thereto, and a pressing sectionwhich presses the contacting sectionagainst the semiconductor elementsuch that each projectioncontacts the contact region. A plurality of the projectionsare arranged such that an arrangement density of outside projectionsis larger than the arrangement density of inside projections

Current application device and manufacturing method of semiconductor element

Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.

A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe devicefor applying current by being in pressure-contact with the power semiconductor H includes: a contact bodywhich surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springswhich press the contact bodyonto the power semiconductor H; the contact bodyand the plurality of electrically-conductive two-tier springsare separate bodies, and the plurality of electrically-conductive two-tier springselectrify the contact bodywhile providing pressing force F to each of a plurality of sections of the contact body

Growing community of inventors

Tochigi, Japan

Yoko Yamaji