Tdk Corporation

Yoji Tozawa

Makoto Yoshino

Shinichi Sato

Takashi Endo

Hidekazu Sato

Akihiko Oide

Masashi Shimoyasu

Seiichi Nakagawa

Satoshi Kurimoto

Ko Onodera

Kazuhiro Ebina

Shinichi Kondo

Shirou Ootsuki

Junichi Otsuka

Takuo Abe

Tsutomu Ono

Makoto Morita

Yohei Tadaki

Naoki Uchida

Yuya Oshima

Mamoru Kawauchi

Kazuo Iwai

Daiki Kato

Shuumi Kumagai

Michiru Ishifune

Hiroshi Ono

Masaki Takahashi

Satoru Okamoto

Katsumi Abe

Hisayuki Abe

Hajime Kato

Yuto Shiga

Masazumi Arata

Noriaki Hamachi

Kunihiko Kawasaki

Kazuma Takahashi

Toshiyuki Anbo

Yuma Ishikawa

Osamu Hirose

Mitsuru Ito

Kouzou Sasaki

Masashi Kitazaki

Yoshinori Mochizuki

Kenta Sasaki

Masahiro Kato

Toshiki Satoh

Takuya Kamei

Taketo Sasaki

A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.

Multilayer inductor component

A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

Electronic component

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

A multilayer coil componentincludes an element bodyhaving a plurality of stacked insulator layersand having an outer surface provided with recessed portionsand, a coildisposed in the element body, and terminal electrodesandconnected to the coiland disposed in the recessed portionsand. The recessed portionsandare defined by a bottom surface and a side surface extending in a depth direction of the recessed portionsandover the outer surface and the bottom surface, the terminal electrodesandhave a first surface facing the bottom surface and a second surface facing the side surface, and a connection region A where a compound of elements constituting the element bodyand a metal component are mixed is exposed to the second surface.

Multilayer coil component

A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

Method of manufacturing laminated coil component

An element body includes a first function portion including a first material, a second function portion including a second material different from the first material, and an intermediate portion placed between the first function portion and the second function portion. The intermediate portion includes a first component included in the first material, and a second component included in the second material. A side surface of the element body includes surfaces of the first function portion, the second function portion, and the intermediate portion. Each of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion. An insulating layer is formed on the side surface in such a manner as to be in contact with at least a region exposed from the electrode portions between the electrode portions in the surface of the intermediate portion.

A multilayer LC filter array includes an element body of a rectangular parallelepiped shape, a first filter including a first inductor and a first capacitor, a second filter including a second inductor and a second capacitor, a first input terminal electrode and a first output terminal electrode that are connected to the first inductor, a second input terminal electrode and a second output terminal electrode that are connected to the second inductor, and a ground terminal electrode that is connected to the first capacitor and the second capacitor. The element body includes a principal surface. The ground terminal electrode is disposed at a center of the principal surface. The first input terminal electrode, the first output terminal electrode, the second input terminal electrode, and the second output terminal electrode are disposed at respective different corner portions of the element body when viewed from a direction orthogonal to the principal surface.

Lamination type LC filter array

An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.

A multilayer coil component has an element body, a coil, a pair of first external electrodes, a pair of second external electrodes, a first connection conductor, and a second connection conductor. The coil is composed of a plurality of internal conductors arranged in the element body and connected to each other. The first external electrodes are arranged on a first principal face of the element body. The second external electrodes are arranged on the first principal face. The first connection conductor is arranged between the coil and the first external electrodes in the element body and is connected to one end of the coil and to the first external electrodes. The second connection conductor is arranged between the coil and the second external electrodes in the element body and is connected to the other end of the coil and to the second external electrodes.

A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

Method for manufacturing electronic component

A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

External electrode forming method

An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.

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Tokyo, Japan

Yoji Tozawa