Shibaura Mechatronics Corporation

Kabushiki Kaisha Toshiba

Yoji Takizawa

Hisashi Nishigaki

Munenori Iwami

Haruka Narita

Takumi Hanada

Tomokazu Ito

Tsukasa Kawakami

Shigeki Matsunaka

Jiro Ikeda

Ivan Petrov Ganachev

Kazuo Monta

Hiroshi Ootsuka

Masatoshi Higuchi

A film formation apparatus includes: a chamber which an interior thereof can be made vacuum; a rotary table provided inside the chamber, holding a workpiece, and circulating and transporting the workpiece in a circular trajectory; a film formation unit including a target formed of film formation material and a plasma generator which turns sputtering gas introduced between the target and the rotary table into plasma, the film formation unit depositing by sputtering film formation material on the workpiece; a film processing unit processing the film deposited by the film formation unit on the workpiece; holding regions each holding the workpiece and provided in a circular film formation region facing the film formation unit and the film processing unit that is a region other than the rotation axis in the rotary table; and a heater provided in the holding regions.

Film formation apparatus

A film forming apparatus includes: a rotary table provided in a chamber; a processing unit configured to perform plasma processing on a workpiece transferred by the rotary table; an inner wall configured to define a processing space and having an opening facing the rotary table; an outer wall configured to cover a periphery of the inner wall with a gap, and configured to form an exhaust space having an opening facing the rotary table; and an exhaust port connected to an exhaust device, wherein the processing unit is a film forming part configured to form a film by sputtering, and wherein both ends of the outer wall are in contact with a side surface of the chamber, and a portion of an outer periphery of the inner wall and the side surface of the chamber are partitioned, so that a reaction gas does not circulate in the exhaust space.

Film forming apparatus

To provide a vacuum processing apparatus applicable to various manufacturing processes, by efficiently and highly reliably stacking films of various types and thicknesses and by downsizing the manufacturing apparatus by suppressing size increase of the apparatus due to increase of the number of film forming chambers caused by increase and complexity of process steps. A vacuum processing apparatus is provided with a plurality of film forming process parts which are provided with rotating transfer tables and film forming chambers. The rotating transfer tables form a transfer path for a work to be processed, in chambers which can be vacuum-exhausted. The film forming chambers are provided for depositing a film on the work to be processed which is arranged and transferred along a circumference which has a rotating shaft of the rotating transfer table as a center. The vacuum processing apparatus is also provided with a connecting part which connects the film forming process parts so as to share a vacuum space between the chambers, and the work to be processed in the film forming process parts is mutually transferred in the vacuum. A load lock mechanism is provided in one of the film forming process part or in the connecting part.

Vacuum processing device

A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

Resin layer formation method, resin layer formation device, disk and disk manufacturing method

A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer ALis formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer ALand hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer ALis formed on the first adhesive layer ALby rotating the substrate P at high speed. The first adhesive layer ALand the second adhesive layer ALare integrated to form a uniform adhesive layer B as a whole.

Resin layer formation method, resin layer formation device, disk, and disk manufacturing method

Resin layer formation method, resin layer formation device, and disk manufacturing method

Determined results of which measured data of a plant is normal/abnormal are mapped to a plant model in an abstract function level hierarchically represented with flow structures of mass/energy and goals to be accomplished by the respective flow structures so as to detect a failure propagation network. In the failure propagation network, a flow structure at the lowest hierarchical level of a network with a top goal of the highest priority is selected as an object to be diagnosed first. In other words, flow structures that are functionally important and close to the origin of anomaly are preferentially diagnosed. The diagnosis for flow structures detects abnormal elements through hypothesis and test. The abnormal element are evaluated with respective mass/energy balances or the like. With respect to the evaluated result, the origin of failure is inferred based on the rule of experience. When the abnormal element has a detailed flow structure, it is diagnosed. Thus, an abnormal position can be detected in more detail.

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Yokohama, Japan

Yoji Takizawa