Sumitomo Bakelite Company Limited

Yoji Shirato

Shunsuke Mochizuki

Koji Choki

Mutsuhiro Matsuyama

Kazuya Kitagawa

Keita Nagahashi

Mika Tsuda

Satoshi Maji

Kenji Miyao

Tetsuya Mori

Keizo Takahama

Kei Watanabe

Kazuya Hirasawa

Hiroshi Owari

Motomi Kurokawa

Makoto Fujiwara

A substrate for a power module () of the present invention includes a metal substrate (), an insulating resin layer () provided on the metal substrate (), and a metal layer () provided on the insulating resin layer (). The insulating resin layer () includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer () at a frequency of 1 kHz and 100&#xb0; C. to 175&#xb0; C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.

Substrate for power module, circuit board for power module, and power module

A thermally conductive sheet of the present invention includes a thermosetting resin (A), and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet according to the present invention, the volume resistivity of the cured product of the thermally conductive sheet, which is measured one minute later after an applied voltage of 1000 V is applied thereto on the basis of JIS K 6911 and at a temperature of 175&#xb0; C., is greater than or equal to 1.0&#xd7;10&#x3a9;&#xb7;m.

Thermally conductive sheet and semiconductor device

A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100&#xb0; C. to 175&#xb0; C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.

An optical waveguide includes a clad layer, a core layer and a clad layer which are laminated together in this order from a lower side thereof. Within the core layer, a core portion and a side clad portion provided adjacent to the core portion so as to surround side surfaces of the core portion are formed. Further, a part of the side clad portion prevents a left side end of the core portion from being exposed outside. A mirror formation region is constituted from a region consisting of such a part of the side clad portion and a part of each of the clad layers located thereabove and therebelow. This mirror formation region is subjected to digging processing so that a concave portion is formed. An inner surface of this concave portion serves as the mirror. From the mirror, a material other than a material constituting the core portion, that is, a material constituting each of the clad layers and a material constituting the side clad portion are exposed.

Optical waveguide and optical waveguide manufacturing member

A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate.

Substrate for mounting an optical element, optical circuit substrate, and substrate on which an optical element is mounted

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Tokyo, Japan

Yoji Shirato