Ibiden Company Limited

Yoji Sawada

Kazuhiko Kuranobu

Tomoya Daizo

Isao Ohno

Nobuhisa Kuroda

Shota Tachibana

Kazuyuki Ueda

Shuto Iwata

Hajime Sakamoto

Katsuyuki Sano

A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

Method for manufacturing wiring substrate

A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.

Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate

A wiring substrate includes a conductor pad, an insulating layer formed on the conductor pad such that the insulating layer is covering the conductor pad and has a through hole, a bump formed on the conductor pad such that the bump is formed in the through hole penetrating through the insulating layer. The conductor pad is formed such that the conductor pad has a connecting surface connected to the bump, a concave part formed on the connecting surface of the conductor pad to the bump, and a convex part formed in the concave part.

Wiring substrate

A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.

Printed wiring board and method for manufacturing printed wiring board

A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.

Method for manufacturing printed wiring board

A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.

A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including first and second pads, a solder resist layer formed on the insulating layer, covering the conductor layer and exposing the first and second pads to form the second pad having diameter smaller than diameter of the first pad, a first bump formed on the first pad and including first base and top plating layers such that the first base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion, and a second bump formed on the second pad and including second base and top plating layers such that the second base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion.

Printed wiring board and method for manufacturing the same

A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.

Printed wiring board

A printed wiring board includes a core substrate, and a build-up layer formed on the substrate. The substrate includes core material, third conductor layer, fourth conductor layer, and through-hole conductors. The build-up layer is formed on the core material and third conductor layer and includes insulating layers, first conductor layers, and via conductors. The build-up layer has central area and outer peripheral area such that the via conductors include central area via conductors and outer peripheral area via conductors, diameter of central area via conductor is smaller than diameter of outer peripheral area via conductor, the outermost first conductor layer includes first pads to mount first electronic component and second pads to mount second electronic component, the first and second pads are connected to each other via the central via conductors, and the lowermost insulating layer does not have the via conductors in the central area of the build-up layer.

Growing community of inventors

Ogaki, Japan

Yoji Sawada