Kabushiki Kaisha Toshiba

Yoji Ogawa

Soichi Inoue

Iwao Higashikawa

Shigehiro Hara

Kazuko Yamamoto

Katsuya Okumura

Munehiro Ogasawara

Hiroko Nakamura

Haruki Komano

Satoshi Masuda

A method of forming a pattern for a semiconductor device comprises the steps of forming a photosensitive film on a substrate and radiating the photosensitive film on the substrate with a beam of a predetermined shape consisting of one of a charged particle beam and an electromagnetic beam, thereby forming an exposed region of a desired shape, the latter step including the step of exposing each of unit regions by a single shot of the beam of the predetermined shape for a predetermined period of time, repeating the exposure a plurality of times, and butt-joining the exposed unit regions to thereby form the exposed region of the desired shape, wherein, in the step of forming the exposed region of the desired shape, butting portions of the unit regions are situated in a first area of a layer to be formed other than a second area in the layer in which predetermined characteristics of a function of the semiconductor device are determined by a pattern width of the exposed region in association with another pattern formed in another layer.

Pattern forming method and pattern forming apparatus

A method of forming a photomask of a semiconductor device comprising the steps of forming a photosensitive film on a substrate and exposing the photosensitive film on the substrate by radiating with a radiation beam a plurality of butting unit regions defining butting portions between the butting unit regions and controlling said radiating of the butting unit region so that the butting portions of the butting unit regions are formed only in portions corresponding to isolation regions or alternatively, they are not formed in portions corresponding to contact areas.

Pattern forming method

A method of repairing a defect existing on a photo mask comprising a transparent substrate and a mask pattern formed on the substrate, comprises steps of irradiating a focused ion beam toward the defect and supplying XeF.sub.2 gas to the defect, when an etching rate of the defect by the focused ion beam and XeF.sub.2 is 1.7 times greater than an etching rate by a sole irradiation of the focused ion beam.

Photo mask and apparatus for repairing photo mask

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Yokohama, Japan

Yoji Ogawa