Fujitsu Corporation

Yoji Murakami

Toshiaki Suzuki

Osamu Yamauchi

Masao Kobayashi

A semiconductor device includes a semiconductor device body, a ring part, and connecting parts. The semiconductor device body includes a resin package and a plurality of leads extending outwardly from the resin package. The ring part is made of a resin and surrounds the semiconductor device body. The connecting parts are made of a resin and connect the semiconductor device body and the ring part, so that the semiconductor device body is supported by the ring part via the connecting parts.

Method for producing semiconductor device having a body with a carrier

Semiconductor device having a body with a carrier ring connected thereto

A lead frame includes an outside frame portion having an central opening, and a rectangular mount portion supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array disposed along a side of the mount portion, respectively, the lead elements included in the array being connected to each other by a common tie bar element, and at least two expandable tie bar elements extending between the outside frame portion and each of the lead element arrays to support each lead element array by the outside frame portion, each of the expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic-plating process thereof.

Lead frame and method of producing electronic components using such

A transfer molding method and apparatus in which the internal pressure of a thermosetting resin in a mold is directly detected and is controlled constantly during the transfer molding.

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Aizuwakamatsu, Japan

Yoji Murakami