Sumitomo Bakelite Company Limited

Yoji Ishimura

Toru Meura

Kensuke Nakamura

Hiroki Nikaido

Kenzou Maejima

A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device () of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (B) in which semiconductor blocks (B,B,B, andB) are stacked in a state of not being solder-bonded. In the semiconductor blocks (B,B,B, andB), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body () is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (B) in a stacked semiconductor component unit.

Method of manufacturing semiconductor device, block stacked body, and sequential stacked body

Provided is a method of manufacturing a semiconductor device that has a plurality of semiconductor components and a plurality of resin layers, the method including: a step in which resin layers and semiconductor components are laminated alternately on a substrate, and the same is adhered by being subjected to heating and pressurization at a temperature lower than the temperature at which the substrate and/or a solder layer of the semiconductor components melts; and a step in which heat and pressure are applied at a temperature at which the solder layer melts or a temperature higher than said temperature.

Manufacturing method for semiconductor device

Provided is a method of manufacturing an electronic device having a first electronic component having a first terminal and a second electronic component having a second terminal, wherein the first electric component is electrically connected to the second electronic component by connecting the first terminal to the second terminal with solder, the method including: providing a resin layer having a flux action between the first terminal and the second terminal to obtain a laminate including the first electronic component, the second electronic component, and the resin layer, wherein a solder is provided on the first terminal or the second terminal; soldering the first terminal and the second terminal; and curing the resin layer while pressing the laminate with a pressurized fluid.

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Tokyo, Japan

Yoji Ishimura