Shinko Electric Industries Co., Ltd.

Yoji Asahi

Yoichi Harayama

Keiichi Takemoto

Tatsuro Yoshida

Yuji Yukiiri

Shuzo Aoki

An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and an embedment part. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a hole open at the second surface of the substrate. The hole includes a threaded inner wall surface. The temperature sensor is at the bottom of the hole. The embedment part includes a threaded side surface, and is embedded in the hole with the threaded side surface mating with the threaded inner wall surface. The substrate and the embedment part are formed of the same material.

Electrostatic chuck and substrate fixing device

An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and a metal material. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a first hole and a second hole aligned in a thickness direction of the substrate in communication with each other. The second hole is closer to the heating part than is the first hole, and open at the second surface of the substrate. The second hole is larger than the first hole when viewed in the thickness direction of the substrate. The temperature sensor is at the bottom of the first hole. The metal material is in the second hole with a space between the temperature sensor and the metal material.

A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.

Substrate fixing device

A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Substrate holding apparatus

A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided.

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Nagano, Japan

Yoji Asahi