Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Yoichiro Nishimoto

Satoshi Arimoto

Keisuke Namba

Hiroaki Morikawa

Takeshi Sakata

Takaaki Iwata

Takashi Ishihara

Tatsushi Sato

Shigeru Matsuno

Yoshihito Imai

Yoshinori Matsuno

Nozomu Yasunaga

Yoshitatsu Kawama

Hideo Naomoto

Tomoko Sendai

Akihiro Takami

Takeyuki Maegawa

Teiji Takahashi

Takayoshi Matsuda

A solar cell includes a first conductive type semiconductor substrate in which a through hole is formed, a second conductive type impurity diffusion layer provided on one-surface side of the semiconductor substrate, a light-receiving surface electrode provided to be electrically connected to the impurity diffusion layer, a lead-out electrode led out to the other-surface side of the semiconductor substrate via the through hole and provided to be electrically connected to the light-receiving surface electrode, and a back-surface electrode electrically connected to the semiconductor substrate on the other-surface side of the semiconductor substrate and electrically separated from the lead-out electrode. The lead-out electrode contains a metal member inside the through hole and is electrically connected to the light-receiving surface electrode.

Solar cell and method for manufacturing the same, and solar cell module

A scraper central portion in which a first contact surface has a trapezoidal shape with a lower base longer than an upper base, and scraper end portions that extend and are bent from respective lateral sides of a trapezoidal shape of the scraper central portion to a side of the first contact surface, and that include second contact surfaces that come in contact with the coating material. A lower base of the scraper central portion and lower sides of the scraper end portions are on the same plane. In a state where the first contact surface is vertical to the surface of the screen plate, the lower base of the scraper central portion and the lower sides of the scraper end portions come in contact with the coating material on the surface of the screen plate, and slide on the surface of the screen plate.

Screen printing device scraper

A cleaning method of a silicon substrate includes a first step of etching a surface of a silicon substrate by a metal-ion-containing mixed aqueous solution of an oxidizing agent and hydrofluoric acid and of forming a porous layer on the surface of the silicon substrate, a second step of etching a pore of the porous layer by mixed acid mainly containing hydrofluoric acid and nitric acid and of forming texture on the surface of the silicon substrate, a third step of etching the surface of the silicon substrate on which the texture is formed with an alkaline chemical solution, and a fourth step of treating the silicon substrate etched by the alkaline chemical solution by ozone-containing water, of generating an air bubble within the pore formed in the silicon substrate, and of removing metal and organic impurities from within the pore.

Cleaning method of silicon substrate and manufacturing method of solar battery

A method includes: a first step of forming a passivation film on a first surface of a crystalline silicon substrate of a first conductive type; a second step of diffusing an element of a second conductive type into a second surface of the crystalline silicon substrate by thermal diffusion to form a diffusion layer, whereby a pn junction is formed; a third step of forming an antireflection film on the diffusion layer; a fourth step of disposing a first electrode paste on the second surface of the crystalline silicon substrate; a fifth step of disposing a second electrode paste on the passivation film; and a sixth step of firing the first electrode paste and the second electrode paste to form electrodes.

Method for manufacturing solar battery cell

Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 &#x3a9;&#xb7;cm and equal to or lower than 5 &#x3a9;&#xb7;cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 &#x3bc;sec and equal to or lower than 4 &#x3bc;sec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.

Wire electric discharge machining method, semiconductor wafer manufacturing method, and solar battery cell manufacturing method

A method of manufacturing a solar cell having a texture on a surface of a silicon substrate includes first forming a porous layer on the surface of the silicon substrate by dipping the silicon substrate into a mixed aqueous solution of oxidizing reagent containing metal ions and hydrofluoric acid. Second, a texture is formed by etching the surface of the silicon substrate after the porous layer is formed, by dipping the silicon substrate into a mixed acid mainly containing hydrofluoric acid and nitric acid.

Method of manufacturing solar cell

A method of manufacturing a solar cell includes forming a diffusion layer on a crystal-type silicon substrate. The diffusion layer has a conductivity opposite to that of the substrate. Furthermore, the method includes etching and removing a part of the diffusion layer by using sodium silicate, and forming a first electrode that makes an electric contact with the diffusion layer and forming a second electrode that makes an electric contact with the substrate.

Solar cell manufacturing method

In preparing a solar cell, minute projections and recesses are uniformly formed in a surface of a single crystal silicon substrate or a polycrystal silicon substrate by dipping in an etching liquid composed of a mixed acid which is composed mainly of a hydrofluoride acid, a nitric acid and a phosphoric acid in addition to a surface active agent. A solar cell having a substrate in which spherical projections and recesses are formed in a surface of it to which light is incident; an apparatus for producing efficiently a solar cell by realizing the above-mentioned process, and a wet etching apparatus to effect stably the above-mentioned process to thereby maintaining a concentration of a nitric acid to be constant, are provided.

Solar cell, a method of producing the same and a semiconductor producing apparatus

In preparing a solar cell, minute projections and recesses are uniformly formed in a surface of a single crystal silicon substrate or a polycrystal silicon substrate by dipping the substrate in an etching liquid of a mixed acid including a hydrofluoride acid, a nitric acid and an adjusting agent containing at least a phosphoric acid or a water-soluble carboxylic acid having a higher molecular weight than acetic acid for adjusting the etching rate of the etching liquid. A solar cell having a substrate in which spherical projections and recesses are formed in a surface thereof to which light is incident; an apparatus for producing a solar cell, and a wet etching apparatus to maintain a constant concentration of a nitric acid, are provided.

The present invention provides a method for producing a solar cell comprising the step of immersing a silicon substrate in an etching solution which includes an aqueous sodium carbonate (Na,CO,) solution, optionally an aqueous sodium hydroxide (NaOH) solution and/or an aqueous sodium bicarbonate (NaHCO,) solution to form minute concave and convex patterns on the surface of the silicon substrate. This method allows quite uniform textures to be formed on the crystal faces while avoiding the problem of disposal of isopropyl.

Method for producing silicon solar cell

Solar cell, a method of producing the same and a semiconductor producing

A solar cell has a high ability to prevent recombination of electrons near the cell surface, wherein a surface of a p-type substrate at a surface is provided with an n-type region subjected to a treatment with a phosphorus containing acid and a silicon nitride layer is then directly formed on the n-type region. The solar cell can be prepared at a low temperature by a method comprising 1) a step of subjecting the n-type region to a phosphorus containing acid treatment at a low temperature and 2) a step of forming a silicon nitride by a vacuum and thermal CVD method.

Solar cell

A solar battery cell, solar battery module, and solar battery module group achieving high product value by enabling the display of surface patterns without reducing the power generating efficiency of the solar battery cells are provided. The direction and/or reflectance of reflected light incident to the surface of the solar battery cell are varied by controlling the distribution of the rough surface structure imparted to the solar battery cell surface. The direction or reflectance of reflected light incident to the surface of the solar battery cell is changed in part depending upon the part of the semiconductor solar battery cell surface to which the light is incident. Semiconductor solar battery cells with high product value can therefore be achieved because patterns with strong visual impact can be displayed and easily recognized without reducing the power generation efficiency of the solar battery cell.

Growing community of inventors

Tokyo, Japan

Yoichiro Nishimoto