Kabushiki Kaisha Topcon

Tokyo Electron Limited

Yoichiro Iwa

Kazuhiro Miyakawa

Akihiko Sekine

Hisashi Isozaki

Gaku Takeuchi

Takao Tanabe

Hiroshi Yoshikawa

Makoto Fujino

Yoshiaki Goto

Kazuo Nunokawa

Masayuki Hideshima

Michihiro Yamazaki

Susumu Saito

Hisakazu Yoshino

Naoto Miki

Yutaka Shida

Takehiro Takase

Hiroaki Soma

An ophthalmologic apparatus is disclosed. In one aspect, the apparatus includes an ocular fundus photographing systems for forming an ocular fundus image of the examined eye, based on a reflective beam from the ocular fundus of the examined eye, and an ocular fundus tracking controller for detecting a gaze direction of the examined eye by receiving the reflective beam reflected at a reflective region of an illumination region illuminated on the ocular fundus and for tracking the ocular fundus based on the detection results of the gaze direction. The ocular fundus tracking controller may include scanning mirrors for scanning an area to detect a reflective beam from the ocular fundus, tracking mirrors for controlling tracking to the ocular fundus, an objective lens disposed opposite to the examined, and an offset mirror Mfor adjusting a detection axis in a gaze direction.

Ophthalmologic apparatus

An ophthalmologic apparatus is disclosed. In one aspect, the apparatus includes ocular fundus photographing systems for forming an ocular fundus image of the examined eye, based on a reflective beam from the ocular fundus of the examined eye, and a light receiving element for receiving the reflective beam reflected at a reflective region of an illumination region illuminated on the ocular fundus. The apparatus further may include a tracking detector having a scanning unit for detecting a gaze direction of the tested eye, and an ocular fundus tracking controller for tracking the ocular fundus photographing system to the gaze direction.

The invention is directed to an ophthalmologic apparatus. The apparatus includes a photographing system that illuminates an ocular fundus of a tested eye, and photographs an image of the ocular fundus of the tested eye based on a reflective beam from the ocular fundus, an aberration measurement part for measuring an optical aberration of the tested eye, an aberration compensation device disposed in the photographing system for compensating the aberration of the tested eye based on signals from the aberration measurement part, and a focusing device for substantially focusing corresponding to a refractive power of the tested eye by moving a part of an optical system comprising the photographing system along an optical axis direction.

A surface inspection method for projecting a laser beam to an inspection surface and for scanning and detecting foreign objects or the like on the inspection surface, comprising a step of being had a required number of detecting regions by a photodetector against a projecting site of the laser beam, a step of receiving a detection light at the photodetector so that a detection light intensity is varied between the detecting regions, a step of acquiring a required number of output signals with different detection light intensities on an inspection site, and a step of selecting an output signal which is an unsaturated output signal and has the highest value among the required number of output signals as a surface detection signal.

Surface inspection method and surface inspection device

A particle monitoring apparatus including a light source configured to emit plural light fluxes, a projecting optical system configured to convert the plural light fluxes into a band-shaped light flux, to lead the band-shaped light flux into a flow passage of a given gas stream, and to partially superpose the plural light fluxes to form a substantially uniform light intensity distribution of the band-shaped light flux in a widthwise direction; a light detector configured to detect intensity of light; and a particle detector configured to determine sizes of the particles passing the light flux based on intensities of the scattered lights detected by the light detector and to count the number of the particles.

Particle monitoring apparatus and vacuum processing apparatus

A method and an apparatus of inspecting the surface of a wafer, where two or more kinds of laser are switched or mixed to make the laser incident on the film-coated wafer by a same incident angle, in which inspection data regarding an inspection apparatus and film parameters regarding a film are stored in storage means of the inspection apparatus in an associated state with each other so as to obtain predetermined inspection conditions. When performing each measurement, an operator sets the film parameters of the wafer to be measured by setting means of the inspection apparatus. Thus, desired inspection conditions are automatically set in the inspection apparatus. The film parameters that the operator sets at each measurement are a film thickness and a film refraction index.

Surface inspection method and apparatus

A surface inspection apparatus of the present invention includes an irradiation optical unit having a multibeam irradiation optical unit for converging and irradiating multiple beams upon a surface of an object to be inspected; a detector which has a light-condensing optical unit including light-sensitive elements for respectively receiving the multiple beams reflected by the surface of the inspecting object; and a processor which obtains a plane-coordinate-position of a position to be irradiated and detected at a reference height position based on a difference between light-receiving reference positions of each of the light-sensitive elements when assumed that the irradiated and detected position of the inspecting object is at the reference height position and actual light-receiving positions of each of the light-sensitive elements, according to a result of analysis and process of surface state information.

Surface inspection apparatus

A surface inspection apparatus includes an LD (for emitting a laser beam (L), an irradiation optical system for entering the emitted laser beam (L) onto an inspection surface () of a wafer at predetermined depression angle (&#x3b1;), a scanning device () to displace the wafer () in order for the laser beam (L) scans the inspection surface () in a spiral, an light intensity detecting device () to detect light intensity, and a scattered light detecting optical system () for guiding scattered light (L) emitted from an irradiation area () in which the laser beam (L) is entered. The light intensity detecting device () includes a multianode PMT () for detecting the light intensity by decomposing the scattered light (L) into 10 channels (ch) in a one-dimensional direction (Y axis direction).

Surface inspection method and surface inspection apparatus

A surface inspection apparatus () comprises a light () source for emitting a light beam L, an optical illumination system () for projecting the light beam on an inspected surface () formed by a film, an optical detection system () having lenses to spatially split reflection lights and an aperture stop () having apertures disposed with polarization elements () for transilluminating mutually different polarized light components, a light intensity detection device () for individually detecting the light intensities of the respective reflection lights passed through the respective polarization elements, a scanning device (), and an arithmetic processing device () for detecting the polarization conditions of the respective reflection lights and obtaining a film thickness of the film and at least one of the physical properties of the film.

A method for inspecting a surface, including entering a predetermined luminous flux at a predetermined incident angle in an inspected surface of an inspection object which is an object of a surface inspection, displaying relatively at least one of the luminous flux and the inspection object so that the luminous flux scans upon the inspected surface, decomposing spatially light intensity of scattered light reflected on an area of the inspected surface entering the luminous flux into a plurality of channels with respect to an one-dimensional direction corresponding to a predetermined direction in the area of the inspected surface entering the light flux, performing inspection of the inspected surface by detecting individually light intensity of each of the decomposed scattered lights obtained by the decomposition, and increasing uniformity of light intensity distribution with respect to at least the predetermined direction in the area of the inspected surface in which the luminous flux is entered.

Method for inspecting surface and apparatus for inspecting it

A surface inspection apparatus comprises: a light source section that emits a first luminous flux and a second luminous flux; an irradiation optical system that irradiates the first luminous flux and the second luminous flux on the surface of the film-coated inspection subject; a displacement section that relatively displaces the film-coated inspection subject and an irradiation luminous flux from the irradiation optical system; a light-receiving optical system that receives scattered light generated from the inspection subject on the film-coated inspection subject after irradiation of the first luminous flux from the irradiation optical system and scattered light generated from the inspection subject on the film-coated inspection subject after irradiation of the second luminous flux from the irradiation optical system; a first light-receiving section that transforms the scattered light of the first luminous flux received by the light-receiving optical system into a first light reception signal; a second light-receiving section that transforms the scattered light of the second luminous flux received by the light-receiving optical system into a second light reception signal; and a sensitivity stabilizing section that synthesizes the first light reception signal and the second light reception signal to form a signal for sampling.

Surface inspecting apparatus

A wafer surface inspection apparatus comprises a light source, an optical system for focusing the light beams from the light source onto the wafer surface, a scanning means for scanning the focused point over a predetermined range on the wafer surface, a photo detector including an photoelectric converter for sensing scattered light from the focused point, and a signal detector for detecting signals from the photo detector, in which the light source is a light source for emitting two different wavelengths, the optical system is adapted to focus the light beams of the two wavelengths on one and the same point on the wafer surface, and the photo detector is adapted to sense the two wavelengths separately, and further comprises a discriminating portion for discriminating between a foreign matter or a scratch on the wafer surface and a recess in a spot form existing on the wafer surface by utilizing outputs from the signal detector.

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Tokyo, Japan

Yoichiro Iwa