Sony Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Yoichiro Fujinaga

Yoshiteru Kamatani

Yoshihito Higashitsutsumi

Shuji Shimizu

Masami Suzuki

Christopher John Wright

Junichi Muramoto

Jan Jasper Van Den Berg

Seiya Tsuzaki

Matthew Lawrenson

Yasuhiro Hosokawa

Tasuku Ogami

Provided with a semiconductor apparatus which is able to be miniaturized and is provided with a Peltier element. The semiconductor apparatus is provided with a semiconductor substrate and the Peltier element which is disposed facing the semiconductor substrate. The Peltier element has a first substrate and a thermoelectric semiconductor which is disposed between the first substrate and the semiconductor substrate. The semiconductor substrate has a first electrode provided on a surface side facing the first substrate. The first substrate has a second electrode provided on a surface side facing the semiconductor substrate. The first electrodes and the second electrodes are each connected to the thermoelectric semiconductor.

Semiconductor apparatus including Peltier element

To suppress a reduction in yield and to reduce production costs even when a failure has occurred with respect to the alignment and the like of a camera module in a multi-ocular configuration in which a plurality of camera modules is included. An image-capturing apparatus includes a plurality of camera modules; and a support member used to support the plurality of camera modules in a specified positional relationship, the image-capturing apparatus including a first camera module and at least one second camera module as the plurality of camera modules, the first camera module being fixed to the support member, the at least one second camera module being fixed to the support member using an adhesive portion formed of an adhesive that has a property of being released in a specific temperature range.

Image-capturing apparatus with a plurality of camera modules and a support member in which at least one camera module is fixed to the support member using an adhesive, and electronic apparatus

A lens module includes a lens body; a lens holding member that movably holds the lens body along an optical axis of the lens body without tilting the optical axis; a displacement element that has a flat-plate shape of which one end edge on a side of the lens body along the optical axis is disposed as a free end and the free end is displaced to freely approach the lens body by applying a voltage; and a push-up member that is disposed on the free end of the displacement element and is inserted on one end surface side of the lens body, which is perpendicular to the optical axis, by the approach towards the lens body of the displacement element so as to push up the lens body in the optical axis direction.

Lens module, image capturing device, and electronic apparatus

A compact and thin lens module that uses a flat-plate-shaped displacement device to drive a lens, and a compact, thin imaging apparatus and electronic system using the lens module.

Lens module, imaging apparatus, electronic system, and method for driving lens module

Growing community of inventors

Kanagawa, Japan

Yoichiro Fujinaga