Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Yoichi Takagi

Nobuaki Ogawa

Hideo Nakagoshi

Tadashi Nomura

Akihiko Kamada

Atsushi Shimizu

Issei Yamamoto

Hidekiyo Takaoka

Mitsuhiro Matsumoto

Masato Yoshida

Kosuke Nakano

Toru Komatsu

Akio Katsube

Tetsuya Oda

Hideki Shinkai

Masaaki Mizushiro

Yoshitaka Echikawa

Yoshitaka Matsukawa

Kosuke Nakono

Kensei Nishida

An electronic component package () includes a resin layer (), an electronic component (), a grounding member (), and a conductor film (). The grounding member () includes a multilayer body () and an outer conductor () disposed at an end portion of the multilayer body () in a lamination direction. The multilayer body () includes at least one resin film () and at least one pattern conductor () laminated one on another, and at least one via conductor () extending in the lamination direction and connected to the outer conductor (). In the multilayer body (), at least one of the pattern conductor () has at least part of a circumference connected to a conductor film () and electrically connected to the via conductor (). Part of an external terminal and part of the outer conductor () are exposed from an identical surface of the resin layer ().

Electronic component package and method for manufacturing the same

A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

Vacuum device

A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

Module and method for manufacturing same

To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

Module, module component composing the module, and method of manufacturing the module

A modulecan be precisely manufactured by mounting an electronic componentand a terminal assemblyhaving a simple configuration, in which a plurality of connection terminalsare supported by a support body, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic componentand the terminal assemblymounted on the one principal surface of the wiring substrate, with a first resin layer. Also, since the plurality of connection terminalsare merely supported by the support body, the support bodycan be easily removed from the plurality of connection terminals. Accordingly, the manufacturing time of the moduleis decreased.

Method of manufacturing module

A plating layer of a Cu-M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu-M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu-M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Electronic component module

A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a moduleby respectively mounting components such as a semiconductor substrateand chip componentson the two main surfacesandof a wiring substrate, the low-profile modulecan be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layerformed by mounting only the semiconductor substrateface down on one main surfaceof the wiring substrateso as to be smaller than the thickness of a second component layerformed by mounting a plurality of chip componentson the other main surfaceof the wiring substrate

Low profile semiconductor module with metal film support

A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Module and method of manufacturing the same

In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu&#x2014;Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Growing community of inventors

Kyoto, Japan

Yoichi Takagi