Toray Industries, Inc.

Yoichi Shinba

Takayoshi Akamatsu

Futoshi Okuyama

Tetsuya Hayashi

Hiroshi Enomoto

Masahiro Oguni

Nobuyuki Kuroki

Yoshio Matsuda

Toshihisa Nonaka

Koichi Fujimaru

Hiroyuki Niwa

Akira Shimada

Yoshiko Tatsuta

Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

Adhesive composition sheet, method of producing same, and semiconductor device

The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Paste composition for light guide and light guide utilizing the same

A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order;

Laminated member for circuit board, method and apparatus for manufacturing of circuit board

The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within &#xb1;0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Methods for making laminated member for circuit board, making circuit board and laminating flexible film

Circuit board, laminated member for circuit board, and method for making laminated member for circuit board

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Otsu, Japan

Yoichi Shinba