Hitachi, Ltd.

Asahi Chemical Research Laboratory Co., Ltd.

Kasei Optonix, Ltd.

Hitachi Medical Corporation

Yoichi Oba

Yamahiro Iwasa

Isao Morooka

Seiki Harada

Atsushi Saiki

Shusaku Eguchi

Katuzo Kanda

Minoru Yoshida

Hiromichi Yamada

Hideki Kohno

Masaaki Hayashi

Yoshiki Kato

Yoshifumi Tomita

Saburo Nonogaki

Heigo Ishihara

Motoo Akagi

Hajime Fukke

Takahiro Kohashi

Hiroshi Takada

Kazuhito Iwasaki

Munehisa Mitsuya

Waichi Nagashiro

Tadao Kaneko

Makoto Tanaka

Atsushi Suzuki

Kikuji Sato

Teruaki Kobayashi

Katsuyoshi Chiba

Yoko Uchida

Teruo Tsunoda

Tsuyoshi Kano

Mitsushi Endo

Atsushi Kabe

Tadashi Fukino

Terue Tsunoda

Yamahiro Isawa

An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.

Electromagnetic wave shielding composition comprising epoxy resin and

Electromagnetic wave shielding circuit and production method thereof

A method is described for producing electrically conductive circuits on a print base board having a copper lamination attached on one side face thereof, and more particularly relates to such method for producing the circuits of excellent electrical conductivity by effectively utilizing a newly developed electrically conductive copper paste which is specifically adapted to metal plating, wherein at least two-layer circuits are formed on one side of the base board, of which a first-layer circuit having a plurality of electrodes and a second-layer circuit having a plurality of ring-shaped electrodes formed in connection with the electrodes of the first-layer circuits, each electrode of the second-layer circuit being defined by outer and inner circumferences with a central opening defined by the inner circumference, such that the metal plating applied to the electrodes of the first- and second-layer circuits with a predetermined thickness of the metal plating layer may provide an electrically conductive path between the two circuits including an elongated total length of the metal plating layer connected to the first-layer circuit, the metal plating layer having an enlarged sectional area to increase the electrical conductivity and to increase the adherence force of the second-layer circuit to the first-layer circuit.

Method for producing electrically conductive circuits on a base board

An automatic soldering apparatus and method thereof is described, wherein a flux is heated up to a predetermined temperature, and is then contacted to a face of a printed base board to thereby coat the base board and to simultaneously heat the latter with the heated flux and then the heated base board is contacted to a melted solder, and wherein provided in combination are apparatus for transporting the base board, apparatus for coating the base board with the heated flux, the flux coating apparatus including a tank in which the flux is stored, heating elements for heating the flux up to a predetermined temperature such that the heated flux is coated on the face of the base board, the heated flux simultaneously heating the base board when the latter is transported to the flux storing tank, and apparatus for soldering the flux coated and heated base board, the soldering apparatus including a tank in which a melted solder is stored which is contacted to the base board when the latter is transported to the tank, and wherein the flux is a solution or a mixture of a solvent which is incombustible and of low evaporability, an activator which may be activated by a temperature higher than that of the heated flux and is stabilized with the temperature of the heated flux and an additive which is easily soluble with the solvent and the activator.

Automatic soldering apparatus and method of using the flux to heat the

A phosphor powder layer is formed by a process comprising a step of mixing a phosphor powder with a polymer emulsion and drying the mixture to give the phosphor powder coated with the polymer and a step of subjecting the phosphor powder coated with the polymer to heating and pressing. The resulting powder layer is suitable as a scintillator used in a radiation detector, particularly in a radiation detector used in X-ray CT.

Process for forming phosphor powder layer

A method of manufacturing a paint composite for magnetic films wherein a mixture consisting of a magnetic powder, a polymer such as polyvinylbutyral, and a solvent is ground under a shear stress of 10-400 kg/cm.sup.2, and the ground mixture has a solvent, an epoxy resin and a phenol resin added thereto and is further ground. When a magnetic disk is produced using a paint which has been obtained by executing the first grinding under a shear stress of 10-400 kg/cm.sup.2 with a kneader or the like, it is endowed with excellent electric characteristics and surface flatness.

Method of manufacturing a paint composite for magnetic films

Pigment-coated phosphors which may be used in the production of a cathode-ray tube of a high contrast for a color television receiver can be produced by adding a pigment and an anionic polymer emulsion to an aqueous suspension of a phosphor and then making the system neutral or weakly acidic or adding a cationic polymer emulsion or carrying out both of these steps so that the phosphor and the pigment may be coated with the polymer.

Process for producing pigment-coated phosphors

A pigment-coated phosphor having good finish sieve passability and capable of forming a fluorescent film with excellent properties can be produced from a process characterized by:

The present invention affords a process for forming a pattern having a surface area substantially equal to or smaller than area of apertures of shadow-mask through which beams pass on a photoresist film, which contains an acrylamidediacetoneacrylamide copolymer and a water-soluble aromatic bisazide compound, by exposing said photoresist film to light through a mask having the pattern and then developing the film. The use of said photoresist film for the preparation of a phosphor screen of a color picture tube of a black matrix or black stripe type does not require a special technique such as post-etching of a shadow mask and makes it possible to form a three primary color phosphor pattern having a surface area substantially equal to or smaller than the area of apertures of the shadow mask through which lightbeams pass, without mutual 'bridging' between phosphor dots. Thus, an excellent phosphor screen of a color picture tube of a black matrix or black stripe type can be prepared.

Formation of pattern using acrylamide-diacetoneacrylamide copolymer

Disclosed is a semiconductor device including a Si body, and SiO.sub.2 layer disposed on the surface of the body, an aluminum oxide layer having a thickness of about 50 A on the SiO.sub.2 layer, which is formed by applying a solution including an aluminum chelate compound onto the SiO.sub.2 layer and heating the solution at a temperature of 300.degree. C. for 30 minutes, and a polymer resin layer of polyimide disposed on the aluminum oxide layer. In this device, the adhesive-strength between the SiO.sub.2 layer and the polyimide layer is remarkably increased when compared with a semiconductor device wherein the polyimide layer is directly disposed on the SiO.sub.2 layer.

Aluminum oxide layer bonding polymer resin layer to semiconductor device

An insulating film provided on the surface of a semiconductor device having a protective film of silicon dioxide is composed of a double layer. The double layer consists of a thin film which is disposed on at least a part of the protective film of silicon dioxide and which is made of an organic compound containing either an amino group as well as an alkoxysilane group or an epoxy group as well as an alkoxysilane group, and a film which is disposed so as to cover the thin film of an organic compound and which is made of a heat-resisting polymer resin. The heat-resisting polymer is the reaction product of 4,4'-diamino-diphenylether, 4,4'-diamino-diphenyl ether-3-carbonyl amide, and pyromellitic acid dianhydride.

Isolating protective film for semiconductor devices and method for

Growing community of inventors

Higashiyamato, Japan

Yoichi Oba