Tokyo Ohka Kogyo Kabushiki Kaisha

Tokyo Ohka Kogyo Co., Ltd.

Shonan Gosei-Jushi Seisakusho K.k.

Yoichi Nakamura

Minoru Tsuda

Hisashi Nakane

Kenji Fujii

Takao Kamiyama

Koji Kaneta

Makoto Ishida

Akira Yokota

Takashi Komine

Shirushi Yamamoto

Hideo Nagata

A rehabilitating pipe for repairing an existing pipe has pipe units that are mutually coupled in a longitudinal direction of the existing pipe. Each of the pipe units has segments that are mutually coupled in a circumferential direction of the existing pipe. Each of the segments has an inner-surface plate and an outer-wall plate extending vertically from and around an entire perimeter of the inner-surface plate. The outer-wall plate has lateral plates extending along a longitudinal direction of the inner-surface plate and end plates connected between the respective lateral plates. Connecting members couple the segments together in the circumferential direction to assemble the pipe unit. A restraining member is attached to and encircles an outer circumference of the assembled pipe unit to restrain the pipe unit.

Rehabilitating pipe for repairing existing pipe and method for repairing existing pipe

A dually photosensitive composition useful as a photoresist in the manufacture of ICs and the like electronic devices, which is positively photosensitive by exposure to ultraviolet in a relatively small dose but negatively photosensitive by exposure to ultraviolet in a substantially larger dose than above or by exposure to far ultraviolet light, is obtained by admixing a positive-type photoresist material comprising a novolac resin and an o-naphthoquinone diazide compound with a bisazide compound such as 4,4'-diazidodiphenyl sulfide. The inventive photosensitive composition provides a possibility of developing an ingenious technique for patterning of a photoresist layer on the substrate such as a checkboard-like patterned layer by use of a photomask of a line-and-space pattern.

Method of forming a positive resist pattern in photoresist of

The present invention relates to a method for forming ultra fine patterns on films of polymethyl isopropenyl ketone or a mixture of polymethyl isopropenyl ketone and a benzophenone compound by exposing such films to ultra violet rays in the range of from 1,000 to 3,500 A. The present invention is particularly useful for providing semiconductors having ultra fine patterns and ultra LSI's. The electric or electronic circuits for electronic or electric apparatus and equipment have been produced by wiring resistors, condensers, coils, vacuum tubes and the like necessary components. However, because of various disadvantages such as assembly requiring much time, complication of work, necessity of using large equipment, reasons or causes for errors, limitation of productivity, impossibility of reducing price or cost and the like, the present invention has been developed for printed circuit boards. However, in the present invention, such active devices as vacuum tubes, resistors, condensers, coils and the like must be fixed on printed circuit boards which have been previously finished. Therefore, although this invention has brought reduction, to some extent, in the time required for the work, complication of work, and the work capacity (scale), it can not yet be said that it has made the work miniaturized or economical. Under such circumstances, through the invention of diodes and transistors by solidification of rectification and amplifying functions in the form of germanium or silicone semiconductors, if has become possible to make the work extremely miniaturized.

Light sensitive compositions of polymethyl isopropenyl ketone

The present invention relates to a method for forming ultra fine patterns on films of polymethyl isopropenyl ketone or a mixture of polymethyl isopropenyl ketone and a benzophenone compound by exposing such films to ultra violet rays in the range of from 1,000 to 3,500 A. The present invention is particularly useful for providing semiconductors having ultra fine patterns and ultra LSI's. The electric or electronic circuits for electronic or electric apparatus and equipment have been produced by wiring resistors, condensers, coils, vacuum tubes and the like necessary components. However, because of various disadvantages such as assembly requiring much time, complication of work, necessity of using large equipment, reasons or causes for errors, limitation of productivity, impossibility of reducing price or cost and the like, the present invention has been developed for printed circuit boards. However, in the present invention, such active devices as vacuum tubes, resistors, condensors, coils and the like must be fixed on printed circuit boards which have been previously finished. Therefore, although this invention has brought reduction, to some extent, in the time required for the work, complication of work, and the work capacity (scale), it can not yet be said that it has made the work miniaturized or economical. Under such circumstances, through the invention of diodes and transistors by solidification of rectification and amplifying functions in the form of germanium or silicone semiconductors, it has become possible to make the work extremely miniaturized.

Photo--imaging a polymethyl isopropenyl ketone (PMIPK) composition

A sensitive composition comprising polymethyl isopropenyl ketone of limited molecular weight and a compound of a given general formula. The formation of a pattern of less than 1 .mu.m is made possible by employing ultraviolet rays of wave lengths of 100-350 nm in place of those of 350-450 nm utilized in conventional processes. The sensitive composition is highly sensitive to ultraviolet rays in said wave range and reproduces a fine pattern precisely.

Growing community of inventors

Samukawa, Japan

Yoichi Nakamura