Murata Manufacturing Co., Ltd.

Yoichi Moriya

Yasutaka Sugimoto

Naoya Mori

Jun Urakawa

Osamu Chikagawa

Tsuyoshi Katsube

Takahiro Takada

Machiko Motoya

Tomoki Kato

Tetsuo Kanamori

Takahiro Hayakawa

Takahiro Sumi

Koji Tanaka

Sadaaki Sakamoto

Tsutomu Tatekawa

Yuki Takemori

Yukihiro Yagi

Tomoki Ouchi

Kahori Takatsuki

Katsuhisa Higashiyama

An elastically deformable electrode that includes a plurality of electrode elements spaced from each other, and a liquid wire which is a liquid conductor configured to electrically connect the plurality of electrode elements. The electrode may also include a solid wire sealing the liquid wire, and an insulator between the solid wire and the plurality of electrode elements.

Electrode

A power module includes a power wiring line provided with a power element, a glass ceramic multilayer substrate provided with a control element to control the power element, and a highly heat-conductive ceramic substrate made of a ceramic material having higher thermal conductivity than a glass ceramic contained in the glass ceramic multilayer substrate. The power wiring line is disposed on the highly heat-conductive ceramic substrate, and the glass ceramic multilayer substrate is disposed directly on the highly heat-conductive ceramic substrate.

Power module and method for manufacturing power module

A composite ceramic multilayer substrate includes a glass ceramic insulating layer including a wiring layer and a highly thermally conductive ceramic insulating layer made of a ceramic material having a higher thermal conductivity than the glass ceramic insulating layer. The glass ceramic insulating layer is provided on at least one main surface of the highly thermally conductive ceramic insulating layer directly and/or with a wiring layer interposed therebetween. When viewed in a direction perpendicular or substantially perpendicular to a main surface of the composite ceramic multilayer substrate, the composite ceramic multilayer substrate includes at least one heat generating element-mounting portion surrounded by the glass ceramic insulating layer and at which a heat generating element-mounting wiring line provide on the main surface of the highly thermally conductive ceramic insulating layer is exposed.

Composite ceramic multilayer substrate, heat generating element-mounting module, and method of producing composite ceramic multilayer substrate

In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.

Semiconductor device

In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu&#x2014;Ba&#x2014;Si based glass with a thickness of about 1 &#x3bc;m to about 5 &#x3bc;m is formed between the metal substrate and the low-temperature sintering ceramic layer.

Metal base substrate and manufacturing method thereof

Provided is a mono- or multilayer ceramic substrate which exhibits a high flexural strength. The substrate contains a sintered ceramic which includes respective crystal phases of quartz, alumina, fresnoite, sanbornite, and celsian, in which the relationship between the diffraction peak intensity A in the (201) plane of the fresnoite and the diffraction peak intensity B in the (110) plane of the quartz, measured by a powder X-ray diffractometry in the range of the diffraction peak angle&#x3b8;=10 to 40&#xb0;, is A/B&#x2267;2.5. The fresnoite crystal phase preferably has an average crystal grain size of 5 &#x3bc;m or less. In firing to obtain this ceramic sintered body, the maximum temperature falls within the range of 980 to 1000&#xb0; C.

Ceramic sintered body and method for producing ceramic sintered body

To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of AlO, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO, relative to a total of 100 parts of SiO, BaO and AlO, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO, BaO, AlOand CeO, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.

Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer

A forsterite powder with superior characteristics which can be sintered at a relatively low temperature can be economically produced, when a magnesium source, a silicon source, and copper particles are mixed to prepare a mixed powder containing 300 to 2,000 ppm by weight of the copper particles, and the mixed powder is fired. The magnesium source used is preferably Mg(OH), and the silicon source used is preferably SiO. A polycrystalline forsterite powder is preferably produced. The magnesium source, the silicon source, and the copper particles can be mixed in the presence of a solvent to prepare the mixed powder. The forsterite powder preferably contains 300 to 2,000 ppm by weight of copper, has a particle size of 0.20 to 0.40 &#x3bc;m and has a crystal size of 0.034 to 0.040 &#x3bc;m.

Method for producing forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component

Method for producing powder forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component

A glass ceramic composition is used for a multilayer ceramic substrateincluding glass ceramic layerslaminated, the multilayer ceramic substratebeing used for a multilayer ceramic module. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO, SrTiOand TiO, and a borosilicate glass powder containing LiO, MgO, BO, SiO, ZnO and AlO. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one material selected from CaTiO, SrTiOand TiO, and a borosilicate glass powder containing LiO, MgO, BO, SiO, ZnO and possibly AlO. The content of the borosilicate glass powder is about 3 percent by weight or more. The borosilicate glass powder further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

An insulating ceramic composition forming insulating ceramic layers () stacked in a multilayer ceramic substrate () used in a monolithic ceramic electronic component, such as a multilayer ceramic module (). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one compound selected from the group consisting of CaTiO, SrTiO, and TiO, and a borosilicate glass powder. The borosilicate glass powder contains 3 to 15 percent by weight of lithium in terms of LiO, 30 to 50 percent by weight of magnesium in terms of MgO, 15 to 30 percent by weight of boron in terms of BO, 10 to 35 percent by weight of silicon in terms of SiO, 6 to 20 percent by weight of zinc in terms of ZnO, and 0 to 15 percent by weight of aluminum in terms of AlO. The insulating ceramic composition can be fired at a temperature of 1000&#xb0; C. or less, and the resulting sintered compact has a low relative dielectric constant, a resonance frequency with a low temperature coefficient, and a high Q value.

Insulating ceramic composition, insulating ceramic sintered body, and mulitlayer ceramic electronic component

An insulating ceramic composition includes a mixture of a ceramic powder containing MgAlOand a glass powder containing 30-60% by mole of silicon oxide on the basis of SiOand 20-55% by mole of magnesium oxide on the basis of MgO, and the ceramic powder further includes MgSiOand TiO. The insulating ceramic composition can be fired at 1000&#xb0; C. and co-sintered with Ag and Cu. An insulating ceramic obtained by sintering the insulating ceramic composition has a high Q-factor and is therefore suitable for ceramic multilayer substrates used at high frequencies.

Composition for insulating ceramics and insulating ceramics using the same

A glass-ceramic composite material for use in forming a multilayered circuit substrate is provided which has a low dielectric constant, but exhibits a relatively high thermal expansion coefficient. Specifically, the glass-ceramic composite material comprises a glass power and a ceramic powder. The glass powder contains: about 30 to 60 mol % of SiO, about 20 to 40 mol % of BaO, 0 to about 40 mol % of MgO, 0 to about 40 mol % of ZnO, 0 to about 20 mol % of BO, with the total content of MgO and ZnO being about 10 to 40 mol %. The ceramic powder contains an alumina powder. The content of the glass powder is set to be at least about 50 wt %. A sintered compact formed by sintering the above glass powder and the above ceramic powder contains a BaO.AlO.2SiO(BaAlSiO) crystal, and its Q value becomes about 400 or more when a measured frequency is 10 GHz.

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Omihachiman, Japan

Yoichi Moriya