Ebara Corporation

Ebara Research Co., Ltd.

Ebapa Corporation

Yoichi Mori

Akira Fukunaga

Toyoji Shinohara

Hiroshi Aono

Yuji Shirao

Tetsuo Komai

Yasuhiko Suzuki

Takashi Kyotani

Junichi Hayakawa

Tadakazu Nishikawa

Saburou Nagano

Masaaki Osato

Yoshihiro Tanabe

Kiyomi Arakawa

An apparatus for treating an exhaust gas that includes a pre-treatment section that removes a powdery component, a water-soluble component or a hydrolytic component from the exhaust gas. The exhaust gas contains a fluorine compound and CO. A heating oxidative decomposing section performs heating oxidative decomposition of at least one of the fluorine compound and CO to detoxify the exhaust gas. The apparatus also has a post-treatment section for post-treating an acid gas such as HF which has been produced by the heating oxidative decomposition.

Method and apparatus for treating exhaust gas

To provide a method and apparatus for treating a waste gas containing fluorine-containing compounds, according to which PFCs can be decomposed efficiently even at low temperature, and moreover fluorine from the product of the decomposition can be recovered for reuse efficiently. An embodiment of the present invention relates to a method of treating a gas containing a fluorine-containing compound, comprising contacting the gas with a treatment agent comprising a mixture of aluminum hydroxide and calcium hydroxide. Moreover, another embodiment of the present invention relates to an apparatus for treating a gas containing a fluorine-containing compound, comprising a treatment column comprising a hollow interior that is packed with a treatment agent comprising a mixture of aluminum hydroxide and calcium hydroxide and through which the gas can pass, heating means capable of heating the hollow interior to a prescribed temperature, a gas introduction port for introducing the gas to be treated into the hollow interior, and an exhaust pipe for discharging gas produced from the hollow interior.

Method and apparatus for treating gas containing flourine-containing compounds

A method for treating exhaust gases containing fluorine-containing compounds which comprises the steps of bringing an exhaust gas containing fluorine-containing compounds into contact with a metal catalyst carrying a tungsten oxide on an alumina-zirconium composite oxide and then bringing the emission into contact with a &#x3b3;-alumina catalyst.

Method and apparatus for treating exhaust gases containing fluorine-containing compounds

An apparatus for treatment of a waste gas, containing fluorine-containing compounds, comprises: a solids treating device for separating solids from the waste gas; an addition device for adding Hand/or HO, or Hand/or HO and O, as a decomposition assist gas to the waste gas leaving the solids treating device; a thermal decomposition device that is packed with &#x3b3;-alumina heated at 600&#x2013;900&#xb0; C., and which thermally decomposes the waste gas to which the decomposition assist gas has been added; an acidic gas treating device for removing acidic gases from the thermally decomposed waste gas; and channels or lines for connecting these devices in sequence. The apparatus preferably includes an air ejector which is capable of adjusting an internal pressure of the apparatus.

Method and apparatus for treating a waste gas containing fluorine-containing compounds

Method for treating exhaust gas containing fluorine-containing compound

The purpose of the present invention is to provide a process and an apparatus for efficiently treating a gas containing fluorine-containing compounds and CO to be discharged, for example, from the step of dry cleaning the inner surfaces and the like of a semiconductor manufacturing apparatus or the step of etching various types of formed films such as oxide films in the semiconductor industry. In order to accomplish the above-mentioned purpose, the gas treating process according to the present invention is a process for treating a gas containing fluorine-containing compounds and CO which comprises contacting the above described gas with O and H O at a temperature of 850&deg; C. or higher to oxidize the CO to CO ; and then contacting the gas with &ggr;-alumina at a temperature of 600 to 900&deg; C. to decompose the fluorine-containing compounds.

Process for treating gas containing fluorine-containing compounds and CO

A method for decomposing a fluorine-containing compound by contacting an exhaust gas containing a fluorine-containing compound, such as C F , with aluminum oxide , such as &ggr;-alumina, which has been heated to a high temperature of, for example, 800&deg; C. to 900&deg; C. There may be such a necessary or larger number of moles of H that the fluorine atoms in the fluorine-containing compound become HF. The method has a high decomposition rate of a fluorine-containing compound, a long life, and involves minimal occurrence of CO.

Method for treating waste gas containing fluorochemical

A process for removing nitrogen oxides in exhaust gases is provided. The process comprises mixing an exhaust gas generated during the chemical vapor deposition process for producing semiconductors and containing dinitrogen monoxide (N O), nitrogen monoxide (NO) and nitrogen dioxide (NO ) with ammonia (NH ) in an amount 0.5-3 times the sum of the stoichiometric amount corresponding to nitrogen monoxide and the stoichiometric amount corresponding to nitrogen dioxide; and then contacting said mixed gas with a noble metal catalyst at a sufficiently high temperature to decompose dinitrogen monoxide, nitrogen monoxide and nitrogen dioxide. Dinitrogen monoxide (N O), nitrogen monoxide (NO) and nitrogen dioxide (NO ) in exhaust gases can be treated in one step. No N O is produced as a by-product.

Method for removing nitrogen oxides in exhaust gas

The present invention aims to provide a process and an apparatus for recovering a PFC gas, which can readily bring cooling traps to a cryogenic temperature with a low-capacity refrigerator and can recover a high-purity PFC gas by applying deep freeze separation without the need for a multistage fractionator. To achieve this object, the present invention relates to an apparatus for recovering a PFC gas from a mixed gas containing the PFC gas discharged from a vacuum processing chamber (etching chamber), comprising a cooling trap connected to the exhaust system of the vacuum processing chamber and adapted to freeze and collect a mixed gas discharged from said vacuum processing chamber, a non-PFC gas removal system for removing gases other than the PFC gas from the regenerated mixed gas emitted by vaporization of said frozen and collected gas after the operation of said cooling trap is stopped, and a recovery means for recovering a high-concentration PFC gas freed of gases other than the PFC gas in said non-PFC gas removal system, as well as a process therefor.

PFC gas recovery process and apparatus

Halogen-containing waste gases resulting from the dry etching step of the process of fabricating semiconductor devices are rendered harmless by removing the halogen compounds concomitant with said waste gases. Waste gases containing halogen compounds are treated by bringing them into contact first with activated carbon and then into contact with a member selected from the group consisting of an alkali agent and a ferric oxide, at a linear velocity of about 3-50 cm/min at ambient temperature, volume ratios of said activated carbon to the alkali agent or the ferric oxide in terms of a substantially dried base being about 2-4, and said alkali agent being selected from a group consisting of calcium hydroxide, calcium oxide, magnesium hydroxide and magnesium oxide.

Method of treating waste gases containing halogen compounds

A gas adsorber which is capable of reliably removing harmful gases discharged from processes in the semiconductor industry, the ceramic industry, etc. The gas adsorber has an integral structure comprising a main treating section having an exhaust gas inlet port and packed with an adsorbent, an auxiliary treating section having a treated gas outlet port and packed with an adsorbent, and a space section provided in between the main and auxiliary treating sections, the space section having a gas outlet port and a gas return port, which provide communication between the space section and a gas sensor. With this arrangement, the adsorption conditions in the main treating section can be perceived accurately.

Gas adsorber for exhaust gas

Waste gases containing ClF.sub.3 are treated by bringing them into contact with iron oxide substantially composed of a ferric oxide (Fe.sub.2 O.sub.3) at a linear velocity of about 10-200 cm/min at ordinary temperatures, or further into contact with an alkali agent at the same linear velocity and temperatures as the above, whereby the content of ClF.sub.3 can be reduced below the permissible level despite simultaneous emission of acidic gases, and yet which is capable of removing the concomitant acidic gases in an effective manner.

Process for treating waste gases containing ClF.sub.3

A method of treating a waste gas containing at least boron trichloride and chlorine comprises first treating the waste gas with a treating agent containing a magnesium compound by a dry process and then treating the waste gas with a treating agent containing a calcium compound by a dry process. Thus, it is possible to remove efficiently a chloride and chlorine containing gas from waste gas discharged from a dry etching process or other manufacturing process in the semiconductor industry. In addition, it is possible to reduce the amount of treating agent used, lengthen the treating agent replacing cycle, and facilitate the maintenance of the system.

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Kanagawa, Japan

Yoichi Mori