Sansha Electric Manufacturing Company, Limited

Yoichi Makimoto

Tomohiro Yamanaka

Shohei Maeda

A semiconductor module includes a case accommodating a semiconductor element inside and being entirely molded by a resin, a first terminal placed on a top portion of the case and being a terminal to which a bus bar being a flat and elongated metal conductor is to be attached, a second terminal provided on the top portion of the case and being adjacent to the first terminal, and a rib provided between the first terminal and the second terminal. The rib includes a protrusion protruding toward the bus bar.

Semiconductor module

An object is to suppress a lift of an external terminal when an external force is applied, thereby improving the reliability of a semiconductor device. A heat radiating platehaving on one main surface a circuit areain which a semiconductor elementis arranged, a pair of terminalsandconnected to the semiconductor element, a resin housingthat covers the circuit areaof the heat radiating plateto seal the semiconductor element, and has a terminal surfaceformed on an upper surface, a pair of side surfaces in the longitudinal direction, and a pair of front and rear surfaces in the lateral direction, are included. The resin housinghas a pair of bending contact portionsandthat come into respectively contact with the pair of terminalsandto define bending positions of the terminalsand. The pair of bending contact portionsandare formed to have different heights. The pair of terminalsandprotrude from the resin housingat positions sandwiching the nut accommodating opening, and are bent so as to overlap each other on the nut accommodating opening

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Osaka, Japan

Yoichi Makimoto