Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Zojirushi Corporation

Rion Company Ltd.

Yoichi Kitamura

Minoru Hashimoto

Takuya Suzuki

Ko Kanaya

Kenji Kawakami

Tatsuya Kaneko

Takumi Nagamine

Takashi Maruyama

Takayuki Nakao

Akira Tsumura

Yukihiro Tahara

Kiyoshi Ishida

Tetsu Owada

Daisuke Sakaue

Yosuke Kondo

Naru Sato

Kenichiro Ichikawa

Takeshi Nakazato

Vacuum flask

In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.

Array antenna apparatus and method for fabricating same

A flexible printed circuit board includes: a base material including a principal face; at least one first wiring pattern disposed on the principal face of the base material and extending along a first direction; and a first member and a second member disposed on the first wiring pattern so as to be spaced from each other in the first direction. In the first direction, the first member and the second member divide the flexible printed circuit board into: a first region located opposite to the second member with respect to the first member in the first direction, a second region located between the first member and the second member, a third region located opposite to the first member with respect to the second member, a fourth region in which the first member is disposed, and a fifth region in which the second member is disposed.

Flexible printed circuit board and joined body

An array antenna apparatus includes: a wiring substrate having a plurality of fed patch antennas and a plurality of active element circuits electrically connected to the plurality of fed patch antennas, respectively; and a plurality of antenna substrates each having a parasitic patch antenna. The plurality of antenna substrates are joined onto one wiring substrate. Thereby, it becomes possible to provide an array antenna apparatus that can be reduced in size and has excellent antenna characteristics.

Array antenna apparatus and method of manufacturing the same

An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.

Electronic component package

Multifunction measuring instrument

A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

Semiconductor chip and radio frequency circuit

A process for producing a circuit module including, carried out in this order, preparing a ceramic carrier substrate having ceramic substrate pads for mounting electronic parts, forming solder paste layers on the ceramic substrate pads, forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder, preliminarily fixing stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace.

Process for producing a circuit module

Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about &#xbd; wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about &#xbc; wavelength at the RF signal frequency.

Even harmonic mixer

A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.

Circuit module and process for producing the same

A connection structure is provided, which can perform an electrical connection between high-frequency circuit substrates in a manner of high workability and productivity. A connection structure comprises: a high-frequency transmission line lead frame connecting a first high-frequency transmission line formed on a first high-frequency circuit substrate to a second high-frequency transmission line formed on a second high-frequency circuit substrate; a plurality of GND electrode lead frames disposed in parallel to the high-frequency transmission line lead frame on both sides thereof, and providing a connection between a first GND electrode of the first high-frequency circuit substrate and a second GND electrode of the second high-frequency circuit substrate; and a reinforcing substrate integrally securing the high-frequency transmission line lead frame and a plurality of GND electrode lead frames.

Growing community of inventors

Tokyo, Japan

Yoichi Kitamura