Universal Entertainment Corporation

Taiyo Yuden Co., Ltd.

Aruze Gaming America, Inc.

Mitsubishi Electric Corporation

Aruze Gaming (hong Kong) Limited

Fujitsu Corporation

Renesas Technology Corp.

Aruze Corporation

Aruza Gaming America, Inc.

Lambda Co., Ltd.

Yoichi Kato

Arata Ajiro

Kenta Sugano

Kotaro Mizuno

Masumi Fujisawa

Takehisa Itagaki

Hiromoto Yamauchi

Yukihiro Konishi

Kazuo Okada

Hiroki Nakamura

Yukinori Inamura

Kenta Kitamura

Kazumasa Yoshizawa

Hiroki Munakata

Daisyun Okamoto

Makoto Miyawaki

Toshitaka Suzuki

Yukihiro Kawakami

Yusuke Kowase

Nariaki Takehara

Hiroaki Kashima

Shohei Kitamura

Toru Makino

Takeshi Aoki

Yoshinori Tanaka

Naoya Shirai

Hiroki Saito

Katsuhiro Kido

Hidetoshi Masuda

Takuya Taniguchi

Takahisa Aoyagi

Kensaku Yoshikawa

Susumu Mio

Kenta Onishi

Yuji Miyagawa

Takeshi Narita

Kazuki Yamada

Masahiro Yoshida

Jun Fujimoto

Kenji Watanabe

Hiroyuki Nishimura

Jun Ishii

Yosuke Sato

Yoshikazu Kondo

Hirokazu Shimizu

Tatsuya Teranishi

Nakayasu Tsukahara

Yasunari Kato

Kenichi Shimomura

Shinji Ogino

Kunio Ueda

Junichi Kogo

Takuto Yano

Tetsuya Oba

Yasuhide Yamamoto

Asako Omote

Masahiro Yata

Joji Kobayashi

Fumiya Abe

Toshimitsu Kogure

Hiroki Sakashita

Bungo Matsumura

Hideko Aoki

Hidenori Wakayanagi

Takashi Hachino

Toshihiko Kosaka

A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked in a vertical direction, the plurality of internal electrode layers being alternately exposed to two end faces of the parallelepiped shape. A side margin section is a section covering edges of the plurality of internal electrode layers in an extension direction toward two side faces of the parallelepiped shape. The side margin section has a structure in which a plurality of dielectric layers, each containing a ceramic as a main component, and a plurality of conductive layers, each containing a metal as a main component, are alternately stacked in the vertical direction. The plurality of conductive layers are respectively spaced and separated from the plurality of internal electrode layers.

Ceramic electronic device and manufacturing method of the same

A ceramic electronic device includes a multilayer chip in which internal electrode layers are alternately stacked with dielectric layers, respectively, and are exposed alternately at a first surface and a second surface of the multilayer chip, wherein, in a capacity section in which the internal electrode layers exposed at the first and second surface overlap each other as viewed in the stacking direction, the dielectric layers are at least three dielectric layers, each dielectric layer including Sn, wherein a dielectric layer having a smaller Sn concentration is closer to an outermost end in the stacking direction than is a dielectric layer having a larger Sn concentration which is located at a center area in the stacking direction, in a relationship of at least two of the at least three dielectric layers in the capacity section.

A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being formed so as to be alternately exposed to two edge faces opposite to each other of the multilayer structure, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a stack direction, the cover layers being mainly composed of ceramic, wherein at least one of a Sn concentration with respect to a main component ceramic in the cover layer or a Sn concentration with respect to a main component ceramic in a side margin section is higher than a Sn concentration with respect to a main component ceramic in a capacity section.

Ceramic electronic component and manufacturing method of the same

A multilayer ceramic capacitor includes a multilayer body including ceramic layers, internal electrodes and a pair of side surfaces, and side margin portions, wherein each of ceramic layers and the side margin portions is composed of a polycrystalline body having a perovskite structure, wherein the side margin portions contain at least one of calcium and strontium, when the side margin portions contain calcium, an atomic ratio of the calcium to titanium in the side margin portions is greater than that in the ceramic layers, and when the side margin portions contains strontium, the atomic ratio of the strontium to titanium in the side margin portions is greater than that in the ceramic layers, wherein glass particles composed of silicon as a main component are dispersed in the polycrystalline body, and an atomic ratio of silicon to titanium is 1 at % or more and 10 at % or less.

Multilayer ceramic capacitor

A multi-layer ceramic capacitor includes a first region, a second region, a multi-layer unit, and a side margin. In the first region, crystal grains including intragranular pores are dispersed. In the second region, crystal grains including intragranular pores are not dispersed. The multi-layer unit includes ceramic layers that are laminated in a first direction and include the second region, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and includes a region, the region being adjacent to the multi-layer unit and including the first region.

Multi-layer ceramic capacitor and method of producing the same preliminary class

A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

Manufacturing method of multilayer ceramic electronic device

A ceramic electronic device includes a multilayer structure in which each of a plurality of internal electrode layers and each of three or more of dielectric layers of which a main component is ceramic are alternately stacked. The three or more of dielectric layers include Sn. A dielectric layer having a smaller Sn concentration is closer to an outermost end in a stacking direction than a dielectric layer having a larger Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of dielectric layers.

A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.

Multi-layer ceramic electronic component

A power control apparatus for an in-vehicle camera includes a temperature sensor which measures the temperature in a camera unit; a temperature data acquisition section which acquires periodically measured temperature data; a predicted temperature calculation section which calculates a temperature gradient from the acquired temperature data group and, based on the temperature gradient, calculates a future predicted camera unit temperature; a power supply section which supplies power to an image processing section; a temperature determination section which determines whether predicted temperature is within an operation guarantee temperature of camera unit component parts; and a power supply control section which, based on a determination result, issues a control command to start or stop power supply to the component parts from the power supply section, the power supply being started or stopped with appropriate timing using the predicted temperature, thereby enabling expeditious protection of the component parts when at high temperature.

Power control apparatus for in-vehicle camera and power control method

In a video image recording device, when a scene outside of a vehicle is recorded through a wind shield, a scene on the inside of a vehicle room is reflected by the wind shield and reflection glare is produced. In order to reduce the influence of this reflection glare, the video image recording device is provided with a video image capture device which obtains a first data on a general video image and a second data on a predetermined part in a vehicle room, wherein the general video image is with a reflection video image, of the predetermined part and also with a transmission video image, a graphical image conversion device which converts the second data into a third data, the third data corresponding to a reflection video image by the wind shield, and a graphical image correction device which corrects the first data based on the third data.

Automobile use video image recording device and automobile use graphical image recognition device

A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.

A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a first dielectric layer of which a main component is ceramic, a first internal electrode layer, a second dielectric layer of which a main component is ceramic, and a second internal electrode layer are stacked in this order, the first internal electrode layer being exposed to a first end face of the parallelepiped shape, the second internal electrode layer being exposed to a second end face of the parallelepiped shape, wherein in the multilayer structure, a conductive layer is provided on a side of the first end face, at a same level in a stacking direction as the second internal electrode, the conductive layer being spaced from the second internal electrode layer. A length of a gap between the second internal electrode layer and the conductive layer is 30 &#x3bc;m or less.

A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.

Multi-layer ceramic capacitor and method of producing the same

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Tokyo, Japan

Yoichi Kato