Kabushiki Kaisha Watanabe Shoko

Other

Kabushiki Kaisha Motoyamaseisakusho

Yoichi Kanno

Masaru Umeda

Masayuki Toda

Masaki Kusuhara

Osamu Uchisawa

Mitsuru Fukagawa

Toshikatu Meguro

Mikio Doi

Kohei Yamamoto

Tadahiro Ohmi

Takashi Onoda

Disclosed is a vaporizer constituted of a dispersing sectionand a vaporizing section. The dispersing sectioncomprises a gas introduction portfor introducing a carrier gasunder pressure into a gas passage, means for feeding raw material solutionsandto the gas passage, and a gas outletfor delivering the carrier gas containing the raw material solutions to the vaporizing section. The vaporizing sectioncomprises a vaporizing tubehaving one end connected to a reaction tube of the MOCVD system and having the other end connected to the gas outletof the dispersing section, and heating means for heating the vaporizing tube. The vaporizing sectionserves to heat and vaporize the raw material solution containing carrier gasdelivered from the dispersing section. The dispersing sectionincludes a dispersing section bodyhaving a cylindrical hollow portion, and a rodhaving an outer diameter smaller than the inner diameter of the cylindrical hollow portion. The rodhas a spiral grooveformed in the external periphery closer to the vaporizing section, the rod ibeing inserted into the cylindrical hollow portion.

Vaporizer for MOCVD and method of vaporizing raw material solutions for MOCVD

Disclosed is a vaporizer constituted of a dispersing sectionand a vaporizing sectionThe dispersing sectioncomprises a gas introduction portfor introducing a carrier gasunder pressure into a gas passage, means for feeding raw material solutionsandto the gas passage, and a gas outletfor delivering the carrier gas containing the raw material solutions to the vaporizing sectionThe vaporizing sectioncomprises a vaporizing tubehaving one end connected to a reaction tube of the MOCVD system and having the other end connected to the gas outletof the dispersing sectionand heating means for heating the vaporizing tubeThe vaporizing sectionserves to heat and vaporize the raw material solution containing carrier gasdelivered from the dispersing sectionThe dispersing sectionincludes a dispersing section bodyhaving a cylindrical hollow portion, and a rodhaving an outer diameter smaller than the inner diameter of the cylindrical hollow portion. The rodhas a spiral grooveformed in the external periphery closer to the vaporizing sectionthe rodbeing inserted into the cylindrical hollow portion.

Disclosed is a vaporizer constituted of a dispersing section and a vaporizing section The dispersing section comprises a gas introduction port for introducing a carrier gas under pressure into a gas passage, means for feeding raw material solutions and to the gas passage, and a gas outlet for delivering the carrier gas containing the raw material solutions to the vaporizing section The vaporizing section comprises a vaporizing tube having one end connected to a reaction tube of the MOCVD system and having the other end connected to the gas outlet of the dispersing section and heating means for heating the vaporizing tube The vaporizing section serves to heat and vaporize the raw material solution containing carrier gas delivered from the dispersing section The dispersing section includes a dispersing section body having a cylindrical hollow portion, and a rod having an outer diameter smaller than the inner diameter of the cylindrical hollow portion. The rod has a spiral groove formed in the external periphery closer to the vaporizing section the rod being inserted into the cylindrical hollow portion.

A device is provided for carrying a thin plate-like substrate such as a semiconductor wafer and for controlling the position of the wafer by floating it with an inert gas of low impurity concentration. A transferring unit and a control unit are both respectively provided with gas nozzles for floating a wafer and with a gas exhausting and circulating system. A plurality of transferring and control units are sealingly interconnected. Each control unit has a vacuum suction hole at its control center, and is provided with nozzles for controlling the wafer in the radial and circumferential directions, respectively, and with nozzles for stopping the wafer and for transporting the wafer to the next unit. On the bottom of a control space defined by each control unit, grooves which extend from the vacuum suction hole are formed for improving the positional accuracy of stopping the wafer. The grooves have closed ends which are located inside the periphery of the wafer when the center of the wafer is positioned above and centered on the control center of the control unit.

Wafer carrying device and wafer carrying method

Growing community of inventors

Miyagi-ken, Japan

Yoichi Kanno