Dow Toray Co., Ltd.

Yoichi Kaminaga

Hiroshi Fukui

Takeaki Tsuda

An organopolysiloxane cured film which can be made thin, has an extremely low number of defects on a surface and inside of the film, and exhibits high dielectric breakdown strength with regard to a load voltage is provided. Also provided are applications thereof and a method of manufacturing. The organopolysiloxane cured film has an average thickness within a range of 1 to 200 &#x3bc;m. In general, the number of surface defects is 0 to 1, and the number of internal defects is 0 to 20, when measuring the number of surface defects using optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm&#xd7;15 mm. The organopolysiloxane cured film may be obtained by a rolling step in a clean room or the like, or may be obtained by curing between separators provided with a release layer.

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Ichihara, Japan

Yoichi Kaminaga