Kabushiki Kaisha Kobe Seiko Sho

Dainippon Screen Mfg. Co., Ltd.

Kobe Steel, Ltd.

Other

Yoichi Inoue

Kimitsugu Saito

Yusuke Muraoka

Yoshihiko Sakashita

Ikuo Mizobata

Takahiko Ishii

Ryuji Kitakado

Katsumi Watanabe

Masahiro Yamagata

Hisanori Oshiba

Tomomi Iwata

Shigeto Adachi

Akira Asari

Kashiro Ureshino

Yoshinori Kurokawa

Hirohiko Fukumoto

Shigeru Yuki

Katsuyuki Iijima

Kaoru Masuda

Kazuhiko Sakiyama

Takayuki Sato

Hiroshi Kawaguchi

Takao Fujikawa

Yutaka Narukawa

Hiroshi Tamagaki

Nobuyuki Kawakami

Hirofumi Fujii

Tsuneharu Masuda

Tetsuya Yoshikawa

Takashi Miyake

Makoto Kadoguchi

Takahisa Tabuchi

Kunihiko Tsuji

Hidehiro Tsuzuki

Koji Hanaguri

Homare Nomura

Katsuhiko Shimojima

Takeshi Suzuki

Toshiya Kido

Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.

High pressure processing method and apparatus

Mixing bathsA andB which temporarily hold chemical agents A and B respectively are disposed. The mixing bathsA andB are each connected with a high-pressure fluid supplying unit. For surface treatment using a mixture of the chemical agent A and SCF (processing fluid), SCF is fed under pressure from the high-pressure fluid supplying unitto the mixing bathA which already holds the chemical agent A, whereby the chemical agent A dissolves in SCF flowing into the mixing bathA and the mixture of the chemical agent A and SCF (processing fluid) is created. As a high-pressure valve (processing fluid introducing valve)is opened, the processing fluid is sent into a pressure vessel. This achieves a predetermined surface treatment of a substrate which has been set inside the pressure vessel, using the processing fluid.

High-pressure processing apparatus and high-pressure processing method

When the hatch of a substrate washing chamberis opened to receive a substrate, certain valves are closed, and a valve is opened, supply COto purge the substrate washing chamberto and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamberso that the COexpels any gas and unwanted air from the substrate washing chamberand the conduits. Thereafter, super critical COis used to wash the substrate and clean the circulation line. The flow of supercritical COis sent to the substrate washing chamber. After flowing through the circulation line, including a circulation channel, it passes through a bypass channelto a decompressor. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bathtogether with the flow.

High pressure processing apparatus and method

When the hatch of a substrate washing chamberis opened to receive a substrate, certain valves are closed, and one valve is opened, to supply COto purge the substrate washing chamberto and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamberso that the COexpels any gas and unwanted air from the substrate washing chamberand the conduits. Thereafter, supercritical COis used to wash the substrate and clean the circulation line. The flow of supercritical COis sent to the substrate washing chamber. After flowing through the circulation line, including a circulation channel, it passes through a bypass channelto a decompressor. Any chemicals or organic substances left in the circulation line are continuously sent to separation/recovery bathtogether with the flow.

In a high pressure processing method for removing an unnecessary substrate on the surface of the surface of a workpiece by bringing it into contact with supercritical carbon dioxide and additives in a high-pressure chamber, removing the unnecessary substance on the workpiece, first rinsing and second rinsing are performed under a substantially same pressure with continuous flowing of supercritical carbon dioxide.

Method of high pressure treatment

A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed. Thus, a high-pressure processing apparatus which has such a compact construction as to be partly installable in a clean room and can stably perform a high-pressure processing can be provided.

High pressure processing apparatus

The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.

High-temperature and high-pressure treatment device

A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.

Method and system for processing substrate

An apparatus for heating a rubber-metal plate composite formed of a plurality of unvulcanized rubber layers and metal plates, each being overlaid alternately, by induction heating, includes an induction coil for applying a magnetic field to the composite and heating the metal plates due to eddy currents generated by the magnetic field, a power unit for applying an alternating current to the induction coil to generate the magnetic field, and a mold to confine the periphery of the composite. The mold is made of a nonmagnetic or weakly magnetic material with electrical conductivity, such as austenitic stainless steel. The mold generates enough heat to function as the heating unit by generating eddy currents in the conductive mold while magnetic flux permeates the mold substantially without loss and reaches the composite therein.

Apparatus for manufacturing a rubber-metal plate composite

A vulcanized rubber-metal plate composite is obtained by overlaying a plurality of unvulcanized rubber layers and metal plates alternately and heating thereof by magnetic induction heating. The vulcanized rubber-metal plate composite is obtained by placing a composite of a plurality of unvulcanized rubber layers and metal plates, each being overlaid alternately, into a place affected by an induction coil; heating the metal plates due to eddy currents formed in the metal plates by applying an alternating current to the induction coil; and vulcanizing the unvulcanized rubber layers due to heat conduction from the heated metal plates.

Arc ion plating device and arc ion plating system

A hot isostatic pressing apparatus having a high pressure vessel, a heat insulating layer and a heater disposed inside the heat insulating layer, the heat insulating layer and the heater being disposed within a high pressure chamber defined by upper and lower covers. The heat insulating layer is composed of at least two inner and outer inverted cup-like casings, the outer casing being metallic and having a hermetic structure and the inner casing having a hermetic structure. A passage is formed in the upper surface of the outer casing and a valve capable of being opened and closed is provided therein. Further, a mechanism for opening and closing the valve is mounted on the upper cover, and a gas passage is formed in the lower portion of the het insulating layer. The above arrangement creates a convection of gas in the cooling step after the HIP treatment whereby a remarkable improvement can be attained in cooling efficiency, cooling time and productivity.

Hot isostatic pressing apparatus

A stacked type heater construction particularly suitable for large HIP apparatus, having a number of heating unit assemblies stacked one on another to provide a vertical series of independently controllable heating zones, the heater including a generally cylindrical heater retaining cage constituted by a number of annular graphitic members serving as girdle frames and a number of graphitic support columns serving as vertical frames, the annular members and support columns being connected with each other through electric insulators and defining a series of divided sections around the heater retaining cage in each one of the heating zones; and a plurality of segmental graphitic heating elements supported in the respective divided sections of the heater retaining cage through electric insulators to form an independent heating circuit in each heating zone.

Heater for hot isostatic pressing apparatus

A hot isostatic pressing apparatus equipped with at least one hot isostatic pressing vessel having a detachable bottom lid and at least one cooling or preheating cylinder or hot isostatic pressing vessel arranged substantially on a central horizontal extension of the former vessel, which apparatus includes a rail provided in front of the former vessel and cylinder or the latter vessel with an interval between the rail and the former vessel and the cylinder or the latter vessel; and a carrier capable of reciprocally travelling between the former vessel and the cylinder or the latter vessel and including a lift frame, a lift provided with the frame and a bottom lid cradle, the cradle being provided in the form of a cantilever with lift and extending to a point underneath the former vessel when the carrier assumes a position in front of the former vessel and to another point underneath the cylinder or the latter vessel when the carrier assumes a position in front of the cylinder or the latter vessel. The above construction permits smooth and free travelling of the carrier and facilitates the overall size reduction and maintenance of the HIP apparatus. Only one carrier is required even if a plurality of HIP vessels or a plurality of HIP vessels and preheating/cooling cylinders is provided so as to improve production efficiency.

A hot isostatic pressing apparatus equipped with a pressure vessel, a heat-insulating layer provided within the pressure vessel and a heating unit disposed inside the heat-insulating layer, in which the heating unit is formed of a cylindrical, self-standing and single-stage heater mounted on an electrical insulator, which is in turn provided in a low-temperature zone of the pressure vessel, and a convection-promoting cylinder provided inside the heater with its lower part supported on the electrical insulator, wherein the upper extremity of the convection-promoting cylinder is located above the upper extremity of the heater, and the convection-promoting cylinder defines a gas flow passage in the lower part thereof. Owing to the provision of the convection-promoting cylinder, the effective height of the uniform temperature zone, namely, the treatment spacing in the pressure vessel is increased by 1.5-3.0 times as compared with a conventional hot isostatic pressing apparatus equipped with no such convection-promoting cylinder and the single-stage heater allows for a reduction in the overall size of the pressing apparatus.

Growing community of inventors

Takasago, Japan

Yoichi Inoue