Mitsubishi Denki Kabushiki Kaisha

Yoichi Goi

Hideki Taniguchi

Naoto Ueda

Hideo Kameda

A semiconductor device includes a buffer region having buffers and disposed along a side of a semiconductor chip; a pad region having pads corresponding to the buffers and disposed outside the buffer region on the semiconductor chip; signal lines connecting the buffers to corresponding pads; and power supply lines and ground lines connected to extra pads, either of the power supply lines or the ground lines being partially superimposed on part of and separated from the signal lines by insulating layers.

Semiconductor device

There are provided an output buffer circuit and an input/output buffer circuit each including pre-driver circuit and main driver circuit divided to a plurality of stages and a delay circuit and enabling operations of the main driver circuit successively with a delay circuit in the pre-driver circuit.

Growing community of inventors

Tokyo, Japan

Yoichi Goi