Hitachi Global Storage Technologies Netherlands B.v.

International Business Machines Corporation

Yohtaroh Ichimura

Tatsushi Yoshida

Yoshio Uematsu

Kenji Itoh

Naoki Kurosu

Tatsumi Tsuchiya

Takayoshi Ohtsu

Haruhide Takahashi

Yukihiro Nakamura

Kousaku Wakatsuki

Shinobu Hagiya

Kouji Kataoka

Kenjirou Watanabe

Yousuke Fukumoto

Shinichi Iwasa

Kohichiroh Naka

Tasushi Yoshida

Takayuki Erikawa

Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200&#xb0; C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.

Method of manufacturing a head gimbal assembly

In a dynamic electric test, a head slider is to be fixed positively to a suspension and to be removable easily from the suspension in accordance with the result of the test. In one embodiment of the present invention a head gimbal assembly includes a head slider, a gimbal and a load beam. The head slider is disposed on a gimbal tongue and is held with an urging force of a resilient clamp at a position between the resilient clamp formed on the leading side of the head slider and connecting terminals formed on the opposite side thereof.

Suspension for hard disk drive which enables easy dynamic electric testing

Embodiments of the invention provide a method for setting a light source parameter in order to recognize an identification mark on an object surface. In one embodiment, a grayscale image is generated by setting the light volume of the light source to a given value. Plural thresholds each for binarizing the grayscale image in density are set. The inter-class variance values to be produced respectively according to the thresholds are calculated and the largest inter-class variance value is selected as the peak inter-class variance value from the inter-class variance values calculated. The light volume is changed to a plurality of different values. Peak inter-class variance values are obtained respectively for the values and the largest peak inter-class variance value is selected as the maximum inter-class variance value from the peak inter-class variance values obtained. The object surface is irradiated by the light source whose light volume is set to a value which would give the maximum inter-class variance value.

Optimized lighting method for slider serial reading using class variance

Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed. Highly accurate attitude correction is thus realized.

Method for manufacturing a magnetic disk device with improved head gimbal assembly

The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P , a bonding wedge abuts the wire , whereby a load is exerted on the wire . The wire transforms by an amount of transformation A, and the transformation stops at point P . The transformation amount A varies greatly. At point P (T ), ultrasonic wave vibration is exerted and the transformation of the wire is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A&plus;B becomes small. At point P (T &plus;T ), the transformation amount A&plus;B is maintained substantially constant. At this point P , the transformation amount of the wire is set to 0 and the measurement of the transformation amount of the wire is started. And until the transformation amount of the wire reaches an amount of transformation C (point P ), a load and ultrasonic wave vibration are given.

Wire bonding method and apparatus

An air tweezer capable of efficiently performing an operation in which an article with a very small size, such as a pico slider or a femto slider, is sucked and set at a predetermined position of a suspension, and having countermeasures against ESD.

Air tweezer and sucking pad

A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.

Growing community of inventors

Kanagawa, Japan

Yohtaroh Ichimura