Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Yohko Furutono

Masayuki Hatano

Tetsuro Nakasugi

Shigeki Nojima

Masafumi Asano

Masato Suzuki

Kazuhiro Takahata

Takumi Ota

Shinji Mikami

Kenji Konomi

Yoko Takekawa

Sachiko Kobayashi

Ryouichi Inanami

According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region.

Mold and mold manufacturing method

In an imprint method according to one embodiment, a template on which a template pattern is formed is pushed against resist on a substrate to be transferred while the resist is cured in this state. The template is subsequently separated from the cured resist. The template is then degassed from the template pattern surface side between after the template is separated from the cured resist and till the template is pushed against resist at the next shot.

Imprint method, imprinting equipment, and method for manufacturing semiconductor device

In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

Imprint apparatus and method

According to one embodiment, first image information of a mold is acquired by irradiating the mold with first light, the mold having an uneven pattern with a shape corresponding to a pattern to be transferred onto a substrate to be processed. The position of the uneven pattern of the mold is adjusted by applying stress to the mold. Second image information is acquired by irradiating the mold whose position is adjusted with the first light. Stress information of the mold whose position is adjusted is measured by comparing the first image information with the second image information. The position adjustment is repeated until the measurement result satisfies a desired condition, and a pattern is formed on the substrate by using the mold whose position is adjusted.

Imprint device and imprint method

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Kanagawa, Japan

Yohko Furutono