Denso Corporation

Yohei Yoshimura

Ryota Tanabe

Akifumi Kurita

Kentaro Fukuda

Takeshi Kusano

Mitsuhiro Suzuki

Tsuyoshi Arai

Akihumi Kurita

A resin part includes a molded main body that has a plate shape with a longitudinal direction and is constituted of an injection-molded product. The resin part has a gate portion that is a vestige of a resin injection gate. The gate portion is located in an end face part of the molded main body to cross a position corresponding to a center of gravity of the molded main body; the end face part extends in the longitudinal direction of the molded main body.

Resin part and its manufacturing method

A resin part includes a plate-shaped molded main body that is constituted of an injection-molded product. Of plate surfaces of the molded main body, a surface on an opposite side to a surface requiring surface accuracy constitutes a pressure-application surface to which pressure is applied by a movable insert. A parting line is formed on the pressure-application surface by the movable insert to satisfy the following relationship: (t/4)&#x2264;x&#x2264;(3t/2), where x is a distance from an end edge part of the molded main body to the parting line and t is a thickness of the molded main body.

A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.

Conductive member module, and production method therefor

A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

Conductive member module, and method of manufacturing the same

In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.

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Kariya, Japan

Yohei Yoshimura