Tokyo Electron Limited

Yohei Yamawaki

Hayato Tanoue

Hirotoshi Mori

Seiji Nakano

Munehisa Kodama

Yohei Yamashita

Yoshihiro Kawaguchi

A separating apparatus configured to separate a processing target object into a first separation body and a second separation body includes a first holder configured to hold the first separation body; a second holder configured to hold the second separation body; a moving unit configured to move the first holder and the second holder relatively to each other; and a separation surface cleaning unit configured to clean at least a separation surface of the first separation body or a separation surface of the second separation body.

Separating apparatus and separating method

A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.

Substrate processing apparatus and substrate processing method

A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a holder moving mechanism configured to move the holder in a horizontal direction; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers in a spiral shape; a modifying device moving mechanism configured to move the modifying device in the horizontal direction; and a controller configured to control an operation of forming the internal modification layers. The controller controls operations of the holder and the modifying device such that a spiral processing movement according to the formation of the internal modification layers and an eccentricity follow-up movement of correcting an eccentric amount between the holder and the processing target object held by the holder are shared by the holder and the modifying device.

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Kumamoto, Japan

Yohei Yamawaki