Fujitsu Corporation

Yohei Yagishita

Shinichi Hirose

Taisuke Iwai

Yoshitaka Yamaguchi

Yukie Sakita

Masaaki Norimatsu

Yoshihiro Mizuno

Seiki Sakuyama

Daiyu Kondo

Ikuo Soga

Koji Asano

An apparatus includes: a transistor including an input terminal for an input signal and an output terminal for an output signal; a matching circuit configured to match a load impedance regarding a fundamental harmonic of at least one of the input signal and the output signal to an impedance of the transistor and include a first conductive film being laminated over the transistor and coupled to at least one of the input terminal and the output terminal; and a processing circuit configured to adjust an impedance regarding a harmonic of at least one of the input signal and the output signal and include a second conductive film being laminated over the first conductive film and coupled to at least one of the input terminal and the output terminal through a via which penetrates through a dielectric layer sandwiched between the first conductive film and the second conductive film.

Power amplification apparatus and electromagnetic radiation apparatus

A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof

An electronic circuit includes adjustment units configured to receive a same oscillating signal having a predetermined frequency and to adjust a phase and an amplitude of the oscillating signal to produce output oscillating signals, coupling points configured to supply the output oscillating signals produced by the adjustment units to antennas, couplers provided in one-to-one correspondence with outputs of the adjustment units, equal-length lines sharing the same length and extending from the couplers, respectively, mixer circuits coupled to the equal-length lines, respectively, each of the mixer circuits being configured to receive a same reference oscillating signal having the predetermined frequency and a corresponding one of the output oscillating signals, and a control circuit configured to cause the adjustment units to adjust at least one of the phase and the amplitude in response to direct-current components in outputs of the mixer circuits.

Electronic circuit, radar apparatus, and method of correcting radar transmission channels

An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Electronic device and method of manufacturing the same

A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Sheet structure, method of manufacturing sheet structure, and electronic device

The electronic device includes a heat generator, a heat radiator, and a heat radiation materialdisposed between the heat generatorand the heat radiatorand including a plurality of linear structuresof carbon atoms and a filling layerformed of a thermoplastic resin and disposed between the plurality of linear structures

Heat radiation material, electronic device and method of manufacturing electronic device

A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Growing community of inventors

Isehara, Japan

Yohei Yagishita