Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yohei Takechi

Jun Yokoyama

Takashi Urashima

Tomotaka Furuta

Yasuhiro Kabetani

Hirotoshi Oikaze

Yutaka Omori

Atsushi Fukui

Kazumasa Takata

Seiji Hamano

Yusuke Kusaka

Nobuo Hara

A laser processing apparatus includes a laser oscillator that oscillates processing laser light to be incident on a processing point on a processing surface of a workpiece, a coupling mirror that deflects or transmits the processing laser light and measurement light to be incident on the processing point toward the processing point, a measurement light deflection unit that changes an incident angle of the measurement light on the coupling mirror, a lens that concentrates the processing laser light and the measurement light on the processing point, a controller that controls the laser oscillator and the measurement light deflection unit, a measurement processor that measures a depth of a keyhole generated at the processing point by the processing laser light by using an optical interference signal based on an interference generated by an optical path difference between the measurement light reflected at the processing point and reference light, and a beam position measurement unit that measures positions of the processing laser light and the measurement light.

Laser processing apparatus and laser processing method

Laser processing apparatus includes movable mirror for changing paths of laser light for processing and measurement light, and stage for changing an incident angle of measuring light. Furthermore, laser processing apparatus includes lens for condensing laser light for processing and measurement light on processing point, controller for controlling laser oscillator, movable mirror, and stage based on corrected data for processing, and measurement processor for measuring a depth of keyhole generated at processing point. The corrected data for processing is data corrected so as to a deviation of an arrival position of at least one of laser light for processing and measurement light caused by chromatic aberration of lens on the surface of workpiece. With this configuration, an accurate depth of keyhole can be measured.

Laser processing apparatus, laser processing method, and correction data generation method

A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

Laser processing apparatus and optical adjustment method

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

OCT measuring device in the present exemplary embodiment includes: wavelength sweep light source that emits light of which a wavelength is swept; optical interferometer that divides the light into measurement light and reference light, emits measurement light toward measurement surface of measuring target object, and generates an optical interference intensity signal indicating an intensity of interference between measurement light reflected from measurement surface and reference light; electro-optic element which is a phase modulator arranged in a light path of optical interferometer; measurement processor which is a signal generator that derives a position of measurement surface and generates a phase amount indicator signal that indicates a phase amount of phase modulator based on the optical interference intensity signal; and electro-optic element controller which is a phase amount controller that controls the phase amount given to the light that is transmitted through phase modulator.

OCT measuring device and oct measuring method

In an inner layer measurement method, first irradiation light and second irradiation light having a peak wavelength longer than that of the first irradiation light are formed by changing at least one of a position where light emitted from a lamp is transmitted through a short pass filter and a position where light emitted from a lamp is transmitted through a long pass filter. Then, a first XY sectional surface of a semitransparent body is measured by irradiating the first XY sectional surface with the first irradiation light. A second XY sectional surface positioned on a layer deeper than the first XY sectional surface is measured by irradiating the second XY sectional surface with the second irradiation light. Each of the short pass filter and the long pass filter can transmit the light and has properties of changing a cutoff wavelength according to the position where the light is transmitted.

Inner layer measurement method and inner layer measurement device

A protective member protects an objective lens. The protective member includes an insertion opening through which an objective lens is configured to be inserted and a main body configured to cover the inserted objective lens. The main body includes a side wall portion connected to the insertion opening and a bottom portion connected to the side wall portion as well as facing the insertion opening, and covers the inserted objective lens with the side wall portion and the bottom portion. The protective member further includes a liquid disposed inside the main body, a sealing film body for sealing the insertion opening and a window arranged in the bottom portion of the main body, through which light transmits. The protective member can simplify the work.

Protective member and method for using protective member

Quality of industrial products is evaluated by evaluating non-stationary operation sound, which is a kind of operation sound, from an aspect of tone, using closely simulated evaluation levels of evaluation of non-stationary sound by used of a human sense of hearing. An operation sound of a conforming product sample is converted into sound waveform data by a sound collecting unit, and the sound waveform data is input into a computer via an A-D converter, and then converted into psychoacoustic parameters. Data of pseudo conforming products is additionally obtained from the psychoacoustic parameters of a plurality of conforming product samples by making use of deviation in the data of the conforming product samples. Threshold data is obtained using thresholds and masking data for evaluation calculated from psychoacoustic parameters of data of the conforming product samples and the pseudo conforming products by a statistical technique. An operation sound of a subject workpiece is converted into sound waveform data by the sound collecting unit, and the sound waveform data is input into the computer via the A-D converter, and then converted into psychoacoustic parameters. Each of the psychoacoustic parameters is compared with the corresponding one of the previously obtained threshold, and thereby the operation sound is evaluated.

Quality evaluation method and quality evaluation apparatus

By using two probe optical systems for measurement by disposing the probe optical systems with a test object sandwiched therebetween, an optical path length of light transmitted through the test object which is identified locally is calculated using an interference signal thereof. In addition, a geometrical thickness of the same part is calculated by measuring positions of the probe optical systems, whereby two calculated values are obtained. Based on the values and a calculated value for a reference object, a refractive index distribution of the test object is obtained.

Refractive index measuring apparatus

The present invention relates to an ultrasonic stress measurement method of measuring a residual stress of a measuring target layer in a measuring object using an ultrasonic wave, the method comprising, setting a plurality of vibration modes according to a number of degree of freedom of the measuring target layer in the measuring object, performing, for each vibration mode, a measurement operation of emitting an ultrasonic wave corresponding to the set vibration mode to the measuring target layer, receiving the ultrasonic wave reflected by the measuring target layer, and measuring an eigenfrequency of the measuring target layer, and measuring the residual stress of the measuring target layer based on plural measurement data of the eigenfrequency with respect to each vibration mode obtained by the measurement operation. The residual stress of the measuring object thus can be measured at higher accuracy.

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Osaka, Japan

Yohei Takechi